SLVSIA7 March   2025 TPSI3050M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristic Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Transmission of the Enable State
      2. 7.3.2  Power Transmission
      3. 7.3.3  Gate Driver
      4. 7.3.4  Modes Overview
      5. 7.3.5  Three-Wire Mode
      6. 7.3.6  Two-Wire Mode
      7. 7.3.7  VDDP, VDDH, and VDDM Undervoltage Lockout (UVLO)
      8. 7.3.8  Keep-Off Circuitry
      9. 7.3.9  Power Supply and EN Sequencing
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Two-Wire or Three-Wire Mode Selection
        2. 8.2.2.2 CDIV1, CDIV2 Capacitance
        3. 8.2.2.3 RPXFR Selection
        4. 8.2.2.4 CVDDP Capacitance
        5. 8.2.2.5 Gate Driver Output Resistor
        6. 8.2.2.6 Start-up Time and Recovery Time
        7. 8.2.2.7 Supplying Auxiliary Current, IAUX From VDDM
        8. 8.2.2.8 VDDM Ripple Voltage
      3. 8.2.3 Application Curves
      4. 8.2.4 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) Corner pins (1, 4, 5, and 8) ±750
Other pins ±500
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
Manufacturing with less than 500V HBM is possible if necessary precautions are taken.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
Manufacturing with less than 250V CDM is possible if necessary precautions are taken.