SLVSJC6 December   2025 TPS544B27W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Operating Frequency and Mode
      2. 6.3.2 Setting the Output Voltage
      3. 6.3.3 DC Load Line
      4. 6.3.4 Fault Management
      5. 6.3.5 Current Sense and Positive Overcurrent Protection
      6. 6.3.6 Negative Overcurrent Limit
      7. 6.3.7 Zero-Crossing Detection
      8. 6.3.8 Overtemperature Protection
      9. 6.3.9 PMBus® Interface
        1. 6.3.9.1 Setting the PMBus® Address
        2. 6.3.9.2 SMBus Alert Response Address
    4. 6.4 Device Functional Modes
      1. 6.4.1 Forced Continuous-Conduction Mode
      2. 6.4.2 DCM Light Load Operation
    5. 6.5 Programming
      1. 6.5.1 PMBus® Command NVM Defaults
  8. 7 Register Maps
    1. 7.1 PMBus® Transaction Types
    2. 7.2 Conventions for Documenting Block Commands
    3. 7.3 PMBus Commands
      1. 7.3.1  OPERATION (Address = 01h)
      2. 7.3.2  ON_OFF_CONFIG (Address = 02h)
      3. 7.3.3  CLEAR_FAULTS (Address = 03h)
      4.      42
      5. 7.3.4  PASSKEY (Address = 0Eh)
      6. 7.3.5  WRITE_PROTECT (Address = 10h)
      7. 7.3.6  STORE_USER_ALL (Address = 15h)
      8.      46
      9. 7.3.7  RESTORE_USER_ALL (Address = 16h)
      10.      48
      11. 7.3.8  CAPABILITY (Address = 19h)
      12. 7.3.9  SMBALERT_MASK (Address = 1Bh)
      13.      51
      14. 7.3.10 SMBALERT_MASK Registers
        1. 7.3.10.1  ALERT_MASK_BYTE (Address = 78h) [Reset = C8h]
        2. 7.3.10.2  ALERT_MASK_WORD (Address = 79h) [Reset = 0Dh]
        3. 7.3.10.3  ALERT_MASK_VOUT (Address = 7Ah) [Reset = XXh]
        4. 7.3.10.4  ALERT_MASK_IOUT (Address = 7Bh) [Reset = XFh]
        5. 7.3.10.5  ALERT_MASK_INPUT (Address = 7Ch) [Reset = XXh]
        6. 7.3.10.6  ALERT_MASK_TEMPERATURE (Address = 7Dh) [Reset = XFh]
        7. 7.3.10.7  ALERT_MASK_CML (Address = 7Eh) [Reset = XXh]
        8. 7.3.10.8  ALERT_MASK_OTHER (Address = 7Fh) [Reset = XFh]
        9. 7.3.10.9  ALERT_MASK_MFR_SPECIFIC (Address = 80h) [Reset = XXh]
        10. 7.3.10.10 ALERT_MASK_PULSE_CATCHER (Address = CEh) [Reset = FXh]
      15. 7.3.11 VOUT_MODE (Address = 20h)
      16. 7.3.12 VOUT_COMMAND (Address = 21h)
      17. 7.3.13 VOUT_TRIM (Address = 22h)
      18. 7.3.14 VOUT_MAX (Address = 24h)
      19.      67
      20. 7.3.15 VOUT_MARGIN_HIGH (Address = 25h)
      21.      69
      22. 7.3.16 VOUT_MARGIN_LOW (Address = 26h)
      23.      71
      24. 7.3.17 VOUT_TRANSITION_RATE (Address = 27h)
      25.      73
      26. 7.3.18 VOUT_DROOP (Address = 28h)
      27. 7.3.19 VOUT_SCALE_LOOP (Address = 29h)
      28.      76
      29. 7.3.20 FREQUENCY_SWITCH (Address = 33h)
      30.      78
      31. 7.3.21 VIN_ON (Address = 35h)
      32.      80
      33. 7.3.22 VIN_OFF (Address = 36h)
      34.      82
      35. 7.3.23 VOUT_OV_FAULT_LIMIT (Address = 40h)
      36.      84
      37. 7.3.24 VOUT_OV_FAULT_RESPONSE (Address = 41h)
      38. 7.3.25 VOUT_OV_WARN_LIMIT (Address = 42h)
      39.      87
      40. 7.3.26 VOUT_UV_WARN_LIMIT (Address = 43h)
      41.      89
      42. 7.3.27 VOUT_UV_FAULT_LIMIT (Address = 44h)
      43.      91
      44. 7.3.28 VOUT_UV_FAULT_RESPONSE (Address = 45h)
      45. 7.3.29 IOUT_OC_FAULT_LIMIT (Address = 46h)
      46.      94
      47. 7.3.30 IOUT_OC_FAULT_RESPONSE (Address = 47h)
      48. 7.3.31 IOUT_OC_WARN_LIMIT (Address = 4Ah)
      49. 7.3.32 OT_FAULT_LIMIT (Address = 4Fh)
      50.      98
      51. 7.3.33 OT_FAULT_RESPONSE (Address = 50h)
      52. 7.3.34 OT_WARN_LIMIT (Address = 51h)
      53.      101
      54. 7.3.35 VIN_OV_FAULT_LIMIT (Address = 55h)
      55.      103
      56. 7.3.36 TON_DELAY (Address = 60h)
      57.      105
      58. 7.3.37 TON_RISE (Address = 61h)
      59. 7.3.38 TOFF_DELAY (Address = 64h)
      60. 7.3.39 TOFF_FALL (Address = 65h)
      61. 7.3.40 PIN_OP_WARN_LIMIT (Address = 6Bh)
      62.      110
      63.      111
      64.      112
      65. 7.3.41 STATUS_BYTE (Address = 78h)
      66. 7.3.42 STATUS_WORD (Address = 79h)
      67. 7.3.43 STATUS_VOUT (Address = 7Ah)
      68. 7.3.44 STATUS_IOUT (Address = 7Bh)
      69. 7.3.45 STATUS_INPUT (Address = 7Ch)
      70. 7.3.46 STATUS_TEMPERATURE (Address = 7Dh)
      71. 7.3.47 STATUS_CML (Address = 7Eh)
      72. 7.3.48 STATUS_OTHER (Address = 7Fh)
      73. 7.3.49 STATUS_MFR_SPECIFIC (Address = 80h)
      74. 7.3.50 READ_VIN (Address = 88h)
      75. 7.3.51 READ_IIN (Address = 89h)
      76. 7.3.52 READ_VOUT (Address = 8Bh)
      77. 7.3.53 READ_IOUT (Address = 8Ch)
      78. 7.3.54 READ_TEMPERATURE_1 (Address = 8Dh)
      79. 7.3.55 READ_PIN (Address = 97h)
      80. 7.3.56 PMBUS_REVISION (Address = 98h)
      81. 7.3.57 MFR_ID (Address = 99h)
      82. 7.3.58 MFR_MODEL (Address = 9Ah)
      83.      131
      84. 7.3.59 MFR_REVISION (Address = 9Bh)
      85. 7.3.60 IC_DEVICE_ID (Address = ADh)
      86. 7.3.61 IC_DEVICE_REV (Address = AEh)
      87.      135
      88. 7.3.62 EXTENDED_WRITE_PROTECT (Address = C7h)
      89. 7.3.63 NVM_PATCH_SPACE (Address = CDh)
      90. 7.3.64 CLOUD_OPTIONS (Address = CFh)
      91. 7.3.65 SYS_CFG_USER1 (Address = D0h)
      92.      140
      93. 7.3.66 SVID_ADDR_CFG_USER (Address = D1h)
      94. 7.3.67 PMBUS_ADDR (Address = D2h)
      95. 7.3.68 IMON_CAL (Address = D4h)
      96. 7.3.69 COMP (Address = D5h)
      97.      145
      98. 7.3.70 VBOOT_DCLL (Address = D6h)
      99. 7.3.71 VBOOT_OFFSET_1 (Address = D7h)
      100. 7.3.72 IIN_CAL (Address = D8h)
      101. 7.3.73 SVID_IMAX (Address = DAh)
      102.      150
      103. 7.3.74 SVID_EXT_CAPABILITY_VIDOMAX (Address = DBh)
      104. 7.3.75 FUSION_ID0 (Address = FCh)
      105. 7.3.76 FUSION_ID1 (Address = FDh)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Inductor Selection
        2. 8.2.3.2 Input Capacitor Selection
        3. 8.2.3.3 Output Capacitor Selection
        4. 8.2.3.4 VCC/VDRV Bypass Capacitor
        5. 8.2.3.5 BOOT Capacitor Selection
        6. 8.2.3.6 RSENSE Selection
        7. 8.2.3.7 I_IN_P and I_IN_M Capacitor Selection
        8. 8.2.3.8 VRRDY Pullup Resistor Selection
        9. 8.2.3.9 PMBus® Address Resistor Selection
      4. 8.2.4 Application Curves
        1. 8.2.4.1 Thermal Performance
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) DEVICE UNIT
VBD (QFN, JEDEC) VBD (QFN, TI EVM)
33 PINS 33 PINS
RθJA Junction-to-ambient thermal resistance 30.5 17.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 8.8 n/a (2) °C/W
RθJB Junction-to-board thermal resistance 10.3 n/a (2) °C/W
ψJT Junction-to-top characterization parameter 2.9 n/a (2) °C/W
ψJB Junction-to-board characterization parameter 10.3 n/a (2) °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – Power stage to PGND 5.5 n/a (2) °C/W
Junction-to-case (bottom) thermal resistance – Power stage to PVIN 8.7 n/a (2) °C/W
Junction-to-case (bottom) thermal resistance – Controller to AGND 15.3 n/a (2) °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The thermal simulation setup is not applicable to a TI EVM layout.