SLVT251 July   2026

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 High-Voltage Stackable Architecture
      2. 2.2.2 Electrochemical Impedance Spectroscopy (EIS) Subsystem
      3. 2.2.3 EIS Synchronization Requirement
      4. 2.2.4 PWM Input as Crystal of the First BQ79826Z-Q1
      5. 2.2.5 Temperature Sensing and Multiplexer Network
      6. 2.2.6 Cell Balancing Circuit and Operation
      7. 2.2.7 MCU and System Control Architecture
      8. 2.2.8 Protection and On-Board Diagnostics
    3. 2.3 Highlighted Products
      1. 2.3.1 BQ79826Z-Q1
      2. 2.3.2 TMUX1308
      3. 2.3.3 TMP61
      4. 2.3.4 SN74LXC1T14
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software
    3. 3.3 Test Setup
    4. 3.4 Pack Test Results
      1. 3.4.1 Cell Voltage Reliability Test
      2. 3.4.2 EIS Measurement Repeatability
      3. 3.4.3 Pack EIS Measurement Nyquist Plot
      4. 3.4.4 Current Consumption per BQ79826Z-Q1
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
    2. 4.2 Tools and Software
      1. 4.2.1 Tools
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5.     Trademarks
  11. 5About the Author

2.2.8 Protection and On-Board Diagnostics

Multi-level protection covers cell OVP/UVP, OTP/UTP, wiring open circuit, EIS excitation overcurrent, communication exception. The system automatically records fault time and code, uploads to upper computer via CAN, supporting remote troubleshooting and operation maintenance. Daily self-diagnosis pre-judges potential hidden dangers to improve system reliability.