SNOU210 November   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Overview
    2. 2.2 Perforations and Connectability
    3. 2.3 Status LEDs and Sub-regulator
    4. 2.4 Remote Sensor
    5. 2.5 Package Swapping
    6. 2.6 Power Supply
    7. 2.7 Programming Header
    8. 2.8 BSL Button
  9. 3Software
    1. 3.1 Software Download
      1. 3.1.1 Live Software on dev.ti.com
      2. 3.1.2 Offline Software
        1. 3.1.2.1 Download From dev.ti.com
    2. 3.2 Home Tab
    3. 3.3 Information Tab
    4. 3.4 Data Tab
    5. 3.5 Registers Tab
    6. 3.6 Collateral Tab
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1. 5.1 Trademarks

2.5 Package Swapping

The EVM is assembled with the TMP411ADDFR device orderable option, which comes in a SOT-23-THIN (DDF) package. However, the EVM also has a landing pattern option for the VSSOP (DGK) package option. This allows the user to optionally remove the TMP411ADDFR and solder the DGK option onto the board to evaluate different device packages. The image below shows the available landing patterns for the DDF and DGK package options.

TMP411 TMP411 Device Footprints Figure 2-3 TMP411 Device Footprints