SNOU210 November   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Overview
    2. 2.2 Perforations and Connectability
    3. 2.3 Status LEDs and Sub-regulator
    4. 2.4 Remote Sensor
    5. 2.5 Package Swapping
    6. 2.6 Power Supply
    7. 2.7 Programming Header
    8. 2.8 BSL Button
  9. 3Software
    1. 3.1 Software Download
      1. 3.1.1 Live Software on dev.ti.com
      2. 3.1.2 Offline Software
        1. 3.1.2.1 Download From dev.ti.com
    2. 3.2 Home Tab
    3. 3.3 Information Tab
    4. 3.4 Data Tab
    5. 3.5 Registers Tab
    6. 3.6 Collateral Tab
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1. 5.1 Trademarks

1.3 Specification

Table 1-2 defines the absolute maximum thermal conditions of each section of the EVM. The main 2 sections are the controller section and the sensor breakout section. These limits must be considered when evaluating the performance of the device at extreme temperatures. In this case, if the setup conditions exceed the controller absolute maximum thermal specifications, then the sensor breakout section must be detached so that only the sensor (and not the MCU) is evaluated at these temperatures.

Table 1-2 Thermal Specifications
BOARD SECTIONCONDITIONSTEMPERATURE RANGE
Controller boardRecommended operating free-air temperature, TA-40°C to 85°C
Absolute maximum junction temperature, TJ95°C
TMP411 breakout

section

Recommended operating free-air temperature, TA-40°C to 125°C