SNOU211 November   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Overview
    2. 2.2 Perforations and Connectability
    3. 2.3 Status LEDs and Sub-regulator
    4. 2.4 Address Selection
    5. 2.5 Power Supply
    6. 2.6 Programming Header
    7. 2.7 BSL Button
  9. 3Software
    1. 3.1 Software Download
      1. 3.1.1 Live Software on dev.ti.com
      2. 3.1.2 Offline Software
        1. 3.1.2.1 Download from dev.ti.com
    2. 3.2 Home Tab
    3. 3.3 Getting Started
    4. 3.4 Information Tab
    5. 3.5 Data Tab
    6. 3.6 Registers Tab
    7. 3.7 Collateral Tab
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1. 5.1 Trademarks

2.4 Address Selection

The TMP113EVM has an Address Selection portion of the breakout section, which has footprints for 4 solderable jumper resistors. The default EVM configuration connects the ADDR pin to GND via jumper R01. The jumper can be moved to the R02, R03, or R04 footprint to connect the ADDR pin to SDA, SCL, or VDD, respectively. See Table 2-2 for the corresponding I2C address for each ADDR pin configuration. Take care to only install 1 jumper at a time to avoid shorts.

When interfacing the ADDR pin on the sensor breakout section to an external connection, all jumpers must be removed first to avoid shorts. Then, a header pin or wire can be soldered to connect ADDR to GND, VDD, SDA, or SCL through the user's custom connection.

Table 2-2 Address Pin and Device Target Address
TARGET I2C ADDRESS ADDR PIN CONNECTION
1001000 GND
1001001 VDD
1001010 SDA

1001011

SCL