SNVSBO7B July   2020  – May 2025 LM63610-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 System Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 SYNC/MODE Selection
      2. 7.3.2 Output Voltage Selection
      3. 7.3.3 Switching Frequency Selection
        1. 7.3.3.1 Spread Spectrum Option
      4. 7.3.4 Enable and Start-up
      5. 7.3.5 RESET Flag Output
      6. 7.3.6 Undervoltage Lockout and Thermal Shutdown and Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Overview
      2. 7.4.2 Light Load Operation
        1. 7.4.2.1 Sync/FPWM Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Minimum On-time Operation
      5. 7.4.5 Current Limit and Short-Circuit Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 CFF Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 CBOOT
        7. 8.2.2.7 VCC
        8. 8.2.2.8 External UVLO
        9. 8.2.2.9 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
      4. 8.2.4 EMI Performance Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.8 System Characteristics

The following specifications apply only to the typical applications circuit with nominal component values. Specifications in the typical (TYP) column apply to TJ = 25°C only. Specifications in the minimum (MIN) and maximum (MAX) columns apply to the case of typical components over the temperature range of TJ = –40°C to 150°C. These specifications are not ensured by production testing.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SUPPLY VOLTAGE (VIN PIN)
ISUPPLYInput supply current when in regulationVIN = 12V, VOUT = 3.3V, IOUT = 0A, RFBT = 1MΩ23µA
VDROPDropout voltage; (VIN – VOUT)VOUT = 5V, IOUT = 1A, fSW = 1850kHz0.95V
VDROPDropout voltage; (VIN – VOUT)VOUT = 5V, IOUT = 1A, VOUT – 1% of regulation, fSW = 140kHz150mV
DMAXMaximum switch duty cycle(2)VIN = VOUT = 12VOUT = 1A98%
VOLTAGE REFERENCE (FB PIN)
VOUT(1)VOUT = 5VVIN = 7V to 30V , IOUT = 1A to full load, CCM–1.5%1.5%
VOUT = 5VVIN = 7V to 30V,  IOUT = 0A to full load, AUTO mode–1.5%2.5%
VOUT(1)VOUT = 3.3VVIN = 3.8V to 30V , IOUT = 1A to full load, CCM–1.5%1.5%
VOUT = 3.3VVIN = 3.8V to 30V , IOUT = 0A to full load, AUTO mode–1.5%2.5%
tSYNC-LDelay from sync clock staying low to PFM entry100ns
tSYNC-HDelay from sync clock staying high to default frequency100ns
THERMAL SHUTDOWN
TSDThermal shutdown temperatureShutdown temperature155163175°C
TSDRThermal shutdown temperatureRecovery temperature150°C
(1) Deviation is with respect to VIN =13.5V, IOUT = 1A.
(2) In dropout the switching frequency drops to increase the effective duty cycle. The lowest frequency is clamped at approximately: fMIN = 1 / (tON-MAX + TOFF-MIN). DMAX = tON-MAX /(tON-MAX + tOFF-MIN).