SNVSCN8A September   2025  – October 2025 TPS923610 , TPS923611 , TPS923612

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Start-up
      2. 7.3.2 Under-Voltage Lockout (UVLO)
      3. 7.3.3 Shutdown
      4. 7.3.4 Boost Control Operation
      5. 7.3.5 Switching Peak Current Limit
      6. 7.3.6 Over-Voltage Protection
      7. 7.3.7 Output Current Setting
      8. 7.3.8 Output Current PWM Controlled Analog Dimming
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation Mode
      2. 7.4.2 Over-Voltage Protection Mode
      3. 7.4.3 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 LED Current Set Resistor
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Thermal Considerations
    3. 8.3 Power Supply Recommendations
    4. 8.4 Application Curves
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SOT563 DRL WSON DRV UNIT
6 PINS 6 PINS
Standard EVM Standard EVM
RθJA Junction-to-ambient thermal resistance 142.7 87.85 93.71 81.69 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 72.6 NA 108.56 64.83 °C/W
RθJB Junction-to-board thermal resistance 31.6 NA 54.15 55.55 °C/W
ψJT Junction-to-top characterization parameter 2.3 14.53 11.58 24.91 °C/W
ψJB Junction-to-board characterization parameter 30.5 57.6 54.27 56.13 °C/W
(1) For more information about traditional and new thermal metrics, see the TI application note Semiconductor and IC Package Thermal Metrics.