The embossed tape-and-reel method is generally preferred by automatic pick-and-place machines, although trays remain an option for those customers who prefer them for nFBGA packages. The tape is made from an antistatic/conductive material. The cover tape, which peels back during use, is heat-sealed to the carrier tape to keep the devices in their cavities during shipping and handling. The tape-and-reel packaging used by Texas Instruments is in full compliance with EIA Standard 481-A, “Taping of Surface-Mount Components for Automatic Placement.” The static-inhibiting materials used in the carrier-tape manufacturing provide device protection from static damage, while the rigid, dust-free polystyrene reels provide mechanical protection and clean-room compatibility with dereeling equipment currently available on most high-speed automated placement systems.