TI’s LoP technology enables direct signal transmission from the package radiating element to the 3D antenna through a waveguide within the PCB, thereby enabling efficient electromagnetic signal transfer. AWR2E44P uses second generation optimized transitions which reduce the transmission distance to antenna elements, improving the RF performance and thermal management. Figure 3-5 shows second generation LoP technology’s use of double ridge waveguides (compared to oblong waveguides used in earlier generation). Double ridge waveguides enable approximately a 17% reduction in the transition size. This reduction is size enables improved board level reliability ensuring stable performance across PCB and antenna assembly variations. This more compact packaging also enables lower RF losses, and provides better spatial coverage by expanding the antenna’s field of view (FOV), which is important for enhanced detection capabilities.

Figure 3-5 Enhancements in TI second generation technology