SPRUJC9B March   2025  – January 2026 AM62L

 

  1.   1
  2.   ABSTRACT
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Before Getting Started With the Custom Board Design
      1. 1.1.1 AM62Lx Processor Family Peripherals and IOs Change Summary (With Respect to AM62x Processor Family)
    2. 1.2 Processor-Specific SDK
    3. 1.3 Peripheral Circuit Implementation - Compatibility Between Processor Families
      1. 1.3.1 AM62Lx Processor Family Specific Implementation
      2. 1.3.2 Implementation Reference
    4. 1.4 Selection of Required Processor OPN (Orderable Part Number)
      1. 1.4.1 Processor Support for Secure Boot and Functional Safety
    5. 1.5 Technical Documentation
      1. 1.5.1 Updated EVM Schematic With Design, Review and Cad Notes Added
      2. 1.5.2 Collaterals on TI.com, Processor Product Page
      3. 1.5.3 Schematic Design Guidelines and Schematic Review Checklist - Processor Family Specific User's Guide
      4. 1.5.4 Updates to Hardware Design Considerations User's Guide
      5. 1.5.5 Processor and Peripherals Related FAQs to Support Custom Board Designs
    6. 1.6 Custom Board Design Documentation
    7. 1.7 Processor and Processor Peripherals Design Related Queries During Custom Board Design
  5. 2 Custom Board Design Block Diagram
    1. 2.1 Developing the Custom Board Design Block Diagram
    2. 2.2 Configuring the Boot Mode
    3. 2.3 Configuring the Processor Pins Functionality (PinMux Configuration)
  6. 3 Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power Architecture
      2. 3.1.2 Discrete Power Architecture
    2. 3.2 Processor Supply (Power) Rails (Operating Voltage)
      1. 3.2.1 Supported Low-Power Modes
      2. 3.2.2 Processor Core and Peripheral Core - Power Supply
      3. 3.2.3 Peripherals Power Supply
      4. 3.2.4 Processor IO Supply for IO Group Power Supply
        1. 3.2.4.1 1.8V or 3.3V Dual-Voltage IO Supply for IO Group Power Supply
          1. 3.2.4.1.1 Additional Information
        2. 3.2.4.2 1.8V Fixed IO Supply for IO Group Power Supply
      5. 3.2.5 Integrated LDO for SD Card Interface IO Supply Switching (Dynamic Switching Dual-voltage IO Supply for MMC1 IO)
      6. 3.2.6 VPP (eFuse ROM Programming) Power Supply
      7. 3.2.7 Internal LDOs for Dual-voltage IO Supply for IO Groups (Processor)
    3. 3.3 Power Supply Filtering
    4. 3.4 Power Supply Decoupling and Bulk Capacitors
      1. 3.4.1 Note on PDN Target Impedance
    5. 3.5 Power Supply Sequencing
    6. 3.6 Power Supply Diagnostics (Voltage Monitor Pins VMON)
    7. 3.7 Power Supply Diagnostics (Monitoring Using External Monitoring Circuit (Devices))
    8. 3.8 Custom Board Current Requirements Estimation and Supply Sizing
  7. 4 Processor Clock (Input and Output)
    1. 4.1 Processor Clocking (External Crystal or External Oscillator)
      1. 4.1.1 LFOSC0 Connection When Unused
      2. 4.1.2 WKUP_OSC0 and LFOSC0, Crystal Selection
      3. 4.1.3 LVCMOS Compatible Digital Clock Input Source
    2. 4.2 Processor Clock Outputs
      1. 4.2.1 Observation Clock Outputs
    3. 4.3 Clock Tree Tool
  8. 5 Joint Test Action Group (JTAG)
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
        1. 5.1.1.1 BSDL File
      2. 5.1.2 Implementation of JTAG / Emulation
      3. 5.1.3 Connection Recommendations for JTAG Interface Signals
      4. 5.1.4 Debug Boot Modes and Boundary Scan Compliance
  9. 6 Configuration (Processor) and Initialization (Processor and Device)
    1. 6.1 Processor Reset
      1. 6.1.1 RTC Power-on Reset (RTC_PORz)
    2. 6.2 Latching of Processor Boot Mode Configuration Inputs
    3. 6.3 Resetting of the Attached Devices
    4. 6.4 Watchdog Timer
  10. 7 Processor - Peripherals Connection
    1. 7.1  Supported Processor Cores
    2. 7.2  Selecting Peripherals Across Domains
    3. 7.3  Memory Controller (DDRSS)
      1. 7.3.1 Processor DDR Subsystem and Device Registers Configuration
      2. 7.3.2 DDR0_CAL0 (IO Pad Calibration Resistor) Connection for DDRSS
      3. 7.3.3 Attached Memory Device ZQ and Reset_N (Memory Device Reset) Connection
      4. 7.3.4 Unused Signals (Pins) on the Memory Device
    4. 7.4  Media, Data Storage Interfaces (MMC0, MMC1, MMC2, OSPI0/QSPI0 and GPMC0)
      1. 7.4.1 Multi-Media Card/Secure Digital (MMCSD) Interface (MMC0, MMC1, MMC2)
      2. 7.4.2 Octal Serial Peripheral Interface (OSPI) or Quad Serial Peripheral Interface (QSPI)
      3. 7.4.3 General-Purpose Memory Controller (GPMC0) Interface
    5. 7.5  Ethernet Interface
      1. 7.5.1 Common Platform Ethernet Switch 3-port Gigabit (CPSW3G0)
    6. 7.6  Programmable Real-Time Unit Subsystem (PRUSS)
    7. 7.7  Universal Serial Bus (USB) Subsystem
    8. 7.8  General Connectivity Peripherals
      1. 7.8.1 Inter-Integrated Circuit (I2C) Interface
    9. 7.9  Analog-to-Digital Converter (ADC0)
    10. 7.10 Display Subsystem (DSS)
    11. 7.11 Connection of Processor Power Supply Pins, IOs and Peripherals When not Used
      1. 7.11.1 External Interrupt (EXTINTn)
      2. 7.11.2 External Wakeup Inputs (EXT_WAKEUP0 and EXT_WAKEUP1)
      3. 7.11.3 RSVD0 Reserved Pin (Signal)
    12. 7.12 EVM Specific Circuit Implementation (Reuse)
  11. 8 Interfacing of Processor IOs (LVCMOS or SDIO or Open-Drain, Fail-Safe Type IO Buffers) and Performing Simulations
    1. 8.1 IBIS Model
    2. 8.2 IBIS-AMI Model
  12. 9 Processor Current Draw and Thermal Analysis
    1. 9.1 Power Estimation
    2. 9.2 Maximum Current Rating for Different Supply Rails
    3. 9.3 Supported Power Modes
    4. 9.4 Thermal Design Guidelines
      1. 9.4.1 Thermal Model
      2. 9.4.2 Voltage Thermal Management Module (VTM)
  13. 10Schematic:- Capture, Entry and Review
    1. 10.1 Custom Board Design Passive Components and Values Selection
    2. 10.2 Custom Board Design Electronic Computer Aided Design (ECAD) Tools Considerations
    3. 10.3 Custom Board Design Schematic Capture
    4. 10.4 Custom Board Design Schematic Review
  14. 11Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
    1. 11.1 Escape Routing for PCB Design
    2. 11.2 DDR Design and Layout Guidelines
    3. 11.3 High-Speed Differential Signals Routing Guidelines
    4. 11.4 Processor-Specific EVM Board Layout
    5. 11.5 Custom Board Layer Count and Layer Stack-up
      1. 11.5.1 Simulation Recommendations
    6. 11.6 DDR-MARGIN-FW
    7. 11.7 Reference for Steps to be Followed for Running Board Simulation
    8. 11.8 Software Development Training (Academy) for Processors
  15. 12Custom Board Assembly and Testing
    1. 12.1 Custom Board Bring-up Tips and Debug Guidelines
  16. 13Processor (Device) Handling and Assembly
    1. 13.1 Processor (Device) Soldering Recommendations
      1. 13.1.1 Additional References
  17. 14Terminology
  18. 15References
    1. 15.1 Processor-Specific (AM62Lx)
    2. 15.2 Common
  19. 16Revision History

10.3 Custom Board Design Schematic Capture

The next phase of the custom board design after completing the schematics design is the schematics capture. During the schematic capture phase, the custom board schematics can be newly drawn or the EVM schematic design can be used (reused as a starting point) to make the updates.

For more information, see the EVM TMDS62LEVM schematic.

Note:

During the custom board design cycle, the recommendation is to follow Schematic Design Guidelines and Schematic Review Checklist for AM62L (AM62L32, AM62L31) Processor Family user's guide along with Hardware Design Considerations for Custom Board Design user's guide.

Additionally, the below FAQ can be used that includes schematic review checklist for AM62Lx processor family:

[FAQ] AM625 / AM623 / AM620-Q1 / AM62Ax / AM62Px / AM62D-Q1 / AM62L / AM64x / AM243x (ALV) / AM335x Design Recommendations / Custom board hardware design - Schematics review checklists

The below FAQ summarizes the considerations when EVM schematics design files are reused for custom board designs:

[FAQ] AM62L ( AM62L32 , AM62L31 ) Custom board hardware design - Reusing TI EVM design files

Note: When the EVM design (schematic) is reused, take care of implementation completeness of the required functionalities (implemented on multiple pages) and change in net names due to design changes or optimization are reviewed and updated. Review and follow the notes (Design, Review and CAD) added on the schematic pages close to the circuit before implementation.

When the EVM design (schematic) is reused, the DNI settings for all the components can reset. Make sure the DNIs are reconfigured (populating DNIs can affect the functionality). Review the DNI notes added on the schematic pages close to the circuit implementation.