SPRUJC9B March   2025  – January 2026 AM62L

 

  1.   1
  2.   ABSTRACT
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Before Getting Started With the Custom Board Design
      1. 1.1.1 AM62Lx Processor Family Peripherals and IOs Change Summary (With Respect to AM62x Processor Family)
    2. 1.2 Processor-Specific SDK
    3. 1.3 Peripheral Circuit Implementation - Compatibility Between Processor Families
      1. 1.3.1 AM62Lx Processor Family Specific Implementation
      2. 1.3.2 Implementation Reference
    4. 1.4 Selection of Required Processor OPN (Orderable Part Number)
      1. 1.4.1 Processor Support for Secure Boot and Functional Safety
    5. 1.5 Technical Documentation
      1. 1.5.1 Updated EVM Schematic With Design, Review and Cad Notes Added
      2. 1.5.2 Collaterals on TI.com, Processor Product Page
      3. 1.5.3 Schematic Design Guidelines and Schematic Review Checklist - Processor Family Specific User's Guide
      4. 1.5.4 Updates to Hardware Design Considerations User's Guide
      5. 1.5.5 Processor and Peripherals Related FAQs to Support Custom Board Designs
    6. 1.6 Custom Board Design Documentation
    7. 1.7 Processor and Processor Peripherals Design Related Queries During Custom Board Design
  5. 2 Custom Board Design Block Diagram
    1. 2.1 Developing the Custom Board Design Block Diagram
    2. 2.2 Configuring the Boot Mode
    3. 2.3 Configuring the Processor Pins Functionality (PinMux Configuration)
  6. 3 Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power Architecture
      2. 3.1.2 Discrete Power Architecture
    2. 3.2 Processor Supply (Power) Rails (Operating Voltage)
      1. 3.2.1 Supported Low-Power Modes
      2. 3.2.2 Processor Core and Peripheral Core - Power Supply
      3. 3.2.3 Peripherals Power Supply
      4. 3.2.4 Processor IO Supply for IO Group Power Supply
        1. 3.2.4.1 1.8V or 3.3V Dual-Voltage IO Supply for IO Group Power Supply
          1. 3.2.4.1.1 Additional Information
        2. 3.2.4.2 1.8V Fixed IO Supply for IO Group Power Supply
      5. 3.2.5 Integrated LDO for SD Card Interface IO Supply Switching (Dynamic Switching Dual-voltage IO Supply for MMC1 IO)
      6. 3.2.6 VPP (eFuse ROM Programming) Power Supply
      7. 3.2.7 Internal LDOs for Dual-voltage IO Supply for IO Groups (Processor)
    3. 3.3 Power Supply Filtering
    4. 3.4 Power Supply Decoupling and Bulk Capacitors
      1. 3.4.1 Note on PDN Target Impedance
    5. 3.5 Power Supply Sequencing
    6. 3.6 Power Supply Diagnostics (Voltage Monitor Pins VMON)
    7. 3.7 Power Supply Diagnostics (Monitoring Using External Monitoring Circuit (Devices))
    8. 3.8 Custom Board Current Requirements Estimation and Supply Sizing
  7. 4 Processor Clock (Input and Output)
    1. 4.1 Processor Clocking (External Crystal or External Oscillator)
      1. 4.1.1 LFOSC0 Connection When Unused
      2. 4.1.2 WKUP_OSC0 and LFOSC0, Crystal Selection
      3. 4.1.3 LVCMOS Compatible Digital Clock Input Source
    2. 4.2 Processor Clock Outputs
      1. 4.2.1 Observation Clock Outputs
    3. 4.3 Clock Tree Tool
  8. 5 Joint Test Action Group (JTAG)
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
        1. 5.1.1.1 BSDL File
      2. 5.1.2 Implementation of JTAG / Emulation
      3. 5.1.3 Connection Recommendations for JTAG Interface Signals
      4. 5.1.4 Debug Boot Modes and Boundary Scan Compliance
  9. 6 Configuration (Processor) and Initialization (Processor and Device)
    1. 6.1 Processor Reset
      1. 6.1.1 RTC Power-on Reset (RTC_PORz)
    2. 6.2 Latching of Processor Boot Mode Configuration Inputs
    3. 6.3 Resetting of the Attached Devices
    4. 6.4 Watchdog Timer
  10. 7 Processor - Peripherals Connection
    1. 7.1  Supported Processor Cores
    2. 7.2  Selecting Peripherals Across Domains
    3. 7.3  Memory Controller (DDRSS)
      1. 7.3.1 Processor DDR Subsystem and Device Registers Configuration
      2. 7.3.2 DDR0_CAL0 (IO Pad Calibration Resistor) Connection for DDRSS
      3. 7.3.3 Attached Memory Device ZQ and Reset_N (Memory Device Reset) Connection
      4. 7.3.4 Unused Signals (Pins) on the Memory Device
    4. 7.4  Media, Data Storage Interfaces (MMC0, MMC1, MMC2, OSPI0/QSPI0 and GPMC0)
      1. 7.4.1 Multi-Media Card/Secure Digital (MMCSD) Interface (MMC0, MMC1, MMC2)
      2. 7.4.2 Octal Serial Peripheral Interface (OSPI) or Quad Serial Peripheral Interface (QSPI)
      3. 7.4.3 General-Purpose Memory Controller (GPMC0) Interface
    5. 7.5  Ethernet Interface
      1. 7.5.1 Common Platform Ethernet Switch 3-port Gigabit (CPSW3G0)
    6. 7.6  Programmable Real-Time Unit Subsystem (PRUSS)
    7. 7.7  Universal Serial Bus (USB) Subsystem
    8. 7.8  General Connectivity Peripherals
      1. 7.8.1 Inter-Integrated Circuit (I2C) Interface
    9. 7.9  Analog-to-Digital Converter (ADC0)
    10. 7.10 Display Subsystem (DSS)
    11. 7.11 Connection of Processor Power Supply Pins, IOs and Peripherals When not Used
      1. 7.11.1 External Interrupt (EXTINTn)
      2. 7.11.2 External Wakeup Inputs (EXT_WAKEUP0 and EXT_WAKEUP1)
      3. 7.11.3 RSVD0 Reserved Pin (Signal)
    12. 7.12 EVM Specific Circuit Implementation (Reuse)
  11. 8 Interfacing of Processor IOs (LVCMOS or SDIO or Open-Drain, Fail-Safe Type IO Buffers) and Performing Simulations
    1. 8.1 IBIS Model
    2. 8.2 IBIS-AMI Model
  12. 9 Processor Current Draw and Thermal Analysis
    1. 9.1 Power Estimation
    2. 9.2 Maximum Current Rating for Different Supply Rails
    3. 9.3 Supported Power Modes
    4. 9.4 Thermal Design Guidelines
      1. 9.4.1 Thermal Model
      2. 9.4.2 Voltage Thermal Management Module (VTM)
  13. 10Schematic:- Capture, Entry and Review
    1. 10.1 Custom Board Design Passive Components and Values Selection
    2. 10.2 Custom Board Design Electronic Computer Aided Design (ECAD) Tools Considerations
    3. 10.3 Custom Board Design Schematic Capture
    4. 10.4 Custom Board Design Schematic Review
  14. 11Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
    1. 11.1 Escape Routing for PCB Design
    2. 11.2 DDR Design and Layout Guidelines
    3. 11.3 High-Speed Differential Signals Routing Guidelines
    4. 11.4 Processor-Specific EVM Board Layout
    5. 11.5 Custom Board Layer Count and Layer Stack-up
      1. 11.5.1 Simulation Recommendations
    6. 11.6 DDR-MARGIN-FW
    7. 11.7 Reference for Steps to be Followed for Running Board Simulation
    8. 11.8 Software Development Training (Academy) for Processors
  15. 12Custom Board Assembly and Testing
    1. 12.1 Custom Board Bring-up Tips and Debug Guidelines
  16. 13Processor (Device) Handling and Assembly
    1. 13.1 Processor (Device) Soldering Recommendations
      1. 13.1.1 Additional References
  17. 14Terminology
  18. 15References
    1. 15.1 Processor-Specific (AM62Lx)
    2. 15.2 Common
  19. 16Revision History

9.4 Thermal Design Guidelines

The Thermal Design Guide for DSP and Arm Application Processors application note provides guidance for implementation of a thermal option for custom board designs using Sitara family of processors. The application note provides background information on common terms and methods. Any follow-up design support that can be required is provided only for board designs that follow thermal design guidelines contained in the application note.

The Thermal model can be downloaded from the below section on the processor-specific product page: