STDA011 September 2025 UCC25661
For a given breakdown voltage and die size GaN FETs has lower conduction losses due to their significant lower RDS(on) compared to silicon MOSFETs. This is due to superior material properties in GaN. This leads to less power dissipation when current is flowing through the device, reducing overall heat generation. This is especially noticeable at high switching frequencies, which are typical in LLC resonant converters.
MOSFETs are also efficient but suffer from higher conduction losses as their RDS(on) increase faster with temperature and voltage.