Power modules (integrated inductor)

The simplest and smallest option for step-down DC/DC voltage conversion

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Power modules with integrated inductors and innovative packaging technology, like those that utilize our new MagPack™ package, are designed to enable a small solution size, high power density and efficiency and meet EMI standards through its construction and the option to place them close to the load (minimizing parasitic inductance through the close proximity of connections). Furthermore, modules support a faster time to market by simplifying the design process and reducing the number of components to purchase.

Buck modules (integrated inductor)

Buck-boost & inverting (integrated inductor)

Flyback modules (integrated inductor)

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Benefits of our power modules

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Reduce overall solution size

Achieve higher power density and reduce overall solution size with modules that integrate the FETs, controller, inductor and passives in a single package that uses 3D integration technology.

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Achieve higher efficiency

Realize best-in-class efficiency with MagPack™ packaging technology that also improves thermal resistance to enable more efficient heat removal and enables a high Safe Operating Area (SOA).

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Accelerate time to market

Go to market faster by eliminating the need for external component sourcing with easy-to-use modules that meet EMI requirements and reduce power design effort up to 45% compared to discrete solutions.

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Minimize system losses

Improve EMI with modules that bring the power supply closer to the load to reduce board and system losses and also utilize MagPack™ technology’s 3D integration and superior shielding.

Technical resources

Video series

Exploring the value of power modules

In this training series, we discuss the high level of integration of our power modules and the significant implications that this has on power-supply design with respect to solution size, EMI, design time and cost.

Technical article

MagPack™ technology: Four benefits of new power modules that can help you pack more power in less space

In power design, size matters and TI has innovated a breakthrough technology for power modules. Leveraging MagPack™ packaging, we help you improve power density and efficiency in your design to push more power into smaller spaces.

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Technical article

Power module package types and their benefits

Power modules enable designers to push more power into smaller spaces. Modules come in all types of packages depending the specific application. Read this article to learn about the different packaging types and their benefits.

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Design & development resources

Design tool

Create customized power supply and active filter circuits

WEBENCH® Circuit Designer creates customized power supply and active filter circuits based on your system requirements. The environment gives you end-to-end selection, design, and simulation capabilities that save you time during all phases of the analog design process.

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Simulation tool

PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)

Design tool

Power Stage Designer™ software tool of most commonly used switchmode power supplies

Power Stage Designer is a JAVA-based tool that helps speed up power-supply designs as it calculates voltages and currents of 21 topologies based on user inputs. Additionally, Power Stage Designer contains a Bode plotting tool and a helpful toolbox with various functions to make power supply design (...)