CD40174B

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CMOS Hex D-Type Flip-Flop

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Product details

Parameters

Technology Family CD4000 Input type Standard CMOS Output type Push-Pull VCC (Min) (V) 3 VCC (Max) (V) 18 Channels (#) 6 Clock Frequency (Max) (MHz) 8 ICC (uA) 600 IOL (Max) (mA) 6.8 IOH (Max) (mA) -6.8 Features Balanced outputs, Standard speed (tpd > 50ns), Positive input clamp diode Rating Catalog open-in-new Find other D-type flip-flop

Package | Pins | Size

PDIP (N) 16 181 mm² 19.3 x 9.4 SOIC (D) 16 59 mm² 9.9 x 6 SOP (NS) 16 80 mm² 10.2 x 7.8 TSSOP (PW) 16 22 mm² 4.4 x 5 open-in-new Find other D-type flip-flop

Features

  • 5-V, 10-V, and 15-V parametric ratings
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Applications:
    • Shift Registers
    • Buffer/Storage Registers
    • Pattern Generators

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Description

Cd40174B consists of six identical ’D’-type flip-flops having independent DATA inputs. The CLOCK and CLEAR\ inputs are common to all six units. Data are transferred to the Q outputs on the positive-going transition of the clock pulse. All sic flip-flops are simultaneously reset by a low level on the CLEAR\ input.

The CD40174B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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Technical documentation

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Type Title Date
* Datasheet CD40174B TYPES datasheet (Rev. C) Oct. 13, 2003
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application notes Power-Up Behavior of Clocked Devices (Rev. A) Feb. 06, 2015
Solution guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics Dec. 03, 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
$10.00
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

CAD/CAE symbols

Package Pins Download
PDIP (N) 16 View options
SO (NS) 16 View options
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

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