TI E2E™ forums with technical support from TI engineers
|*||Data sheet||CSD86336Q3D Synchronous Buck NexFET™ Power Block datasheet||PDF | HTML||08 Mar 2018|
|Application note||MOSFET Support and Training Tools (Rev. A)||PDF | HTML||04 Nov 2022|
|Application note||Tips for Successfully Paralleling Power MOSFETs||PDF | HTML||31 May 2022|
|Technical article||How to choose the right power MOSFET or power block package for your application||29 Oct 2019|
|Technical article||Discrete FETs vs. power blocks - how to choose the right SOA for your design||06 Jun 2019|
|Technical article||Understanding the benefits of “lead-free” power MOSFETs||08 Feb 2019|
|Application note||QFN and SON PCB Attachment (Rev. B)||PDF | HTML||24 Aug 2018|
|Application note||Semiconductor and IC Package Thermal Metrics (Rev. C)||PDF | HTML||19 Apr 2016|
|Technical article||When to use load switches in place of discrete MOSFETs||03 Feb 2016|
|Application note||Ringing Reduction Techniques for NexFET High Performance MOSFETs||16 Nov 2011|
|Application note||PowerStack™ Packaging Technology Overview||18 Jul 2011|
For additional terms or required resources, click any title below to view the detail page where available.
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.