High Temperature 3V LVDS Differential Driver
Product details
Parameters
Package | Pins | Size
Features
- –40°C to 125°C Operating Temperature Range
- Conforms to TIA/EIA-644-A Standard
- >400-Mbps (200-MHz) Switching Rates
- 700-ps (100-ps Typical) Maximum Differential Skew
- 1.5-ns Maximum Propagation Delay
- Single 3.3-V Power Supply
- ±350-mV Differential Signaling
- Power Off Protection (Outputs in TRI-STATE)
- Pinout Simplifies PCB Layout
- Low Power Dissipation (23 mW at 3.3 V Typical)
- 5-Pin SOT-23 Package
- Pin Compatible With SN65LVDS1
All trademarks are the property of their respective owners.
Description
The DS90LV011AH is an LVDS driver optimized for high data rate and low power applications. The DS90LV011AH is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is designed to support data rates in excess of 400Mbps (200MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.
The device is offered in a 5-pin SOT-23 package. The LVDS outputs have been arranged for easy PCB layout. The differential driver outputs provide low electromagnetic interference (EMI) with its typical low output swing of 350 mV. The DS90LV011AH can be paired with its companion single line receiver, the DS90LT012AH, or with any of TI’s LVDS receivers, to provide a high-speed LVDS interface.
Same functionality and pinout but is not an equivalent to the compared device:
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | DS90LV011AH high temperature 3-V LVDS differential driver datasheet (Rev. B) | Jan. 10, 2019 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- DS90LV047A: Converts single-ended LVCMOS to differential LVDS
- DS90LV048A: Converts differential LVDS to single-ended LVCMOS
- Greater than 400-Mbps (200 MHz) switching rates
- Single-supply operation: 3.3 V
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| SOT-23 (DBV) | 5 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.