MSP430FR5969-SP

ACTIVE

Radiation Hardened Mixed-Signal Microcontroller

MSP430FR5969-SP

ACTIVE

Product details

CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 64 RAM (kByte) 2 ADC type 12-bit SAR Features AES, DMA, Real-time clock UART 2 Number of ADC channels 16 SPI 3 USB No Hardware accelerators 0 Operating temperature range (°C) -55 to 105 Rating Space Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Nonvolatile memory (kByte) 64 Number of GPIOs 40 Number of I2Cs 1 Security Cryptographic acceleration, Secure communication, Secure debug, Software IP protection
CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 64 RAM (kByte) 2 ADC type 12-bit SAR Features AES, DMA, Real-time clock UART 2 Number of ADC channels 16 SPI 3 USB No Hardware accelerators 0 Operating temperature range (°C) -55 to 105 Rating Space Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Nonvolatile memory (kByte) 64 Number of GPIOs 40 Number of I2Cs 1 Security Cryptographic acceleration, Secure communication, Secure debug, Software IP protection
HTQFP (PHP) 48 81 mm² 9 x 9 VQFN (RGZ) 48 49 mm² 7 x 7
  • Radiation-Hardness Assured
    • Extended Temperature Operation (–55°C to 105°C) (1)
    • Single Event Latchup (SEL) Immune to 72 MeV.cm2/mg at 125°C
    • Radiation Lot Acceptance Tested to 50 krad
    • 48-pin VQFN Plastic Package
    • Single Controlled Baseline
    • Extended Product Change Notification
    • Product Traceability
    • Extended Product Life Cycle
  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 16‑MHz Clock
    • Wide Supply Voltage Range
      (1.8 V to 3.6 V) (2)
  • Optimized Ultra-Low-Power Modes
    • Active Mode: Approximately 100 µA/MHz
    • Standby (LPM3 With VLO): 0.4 µA (Typical)
    • Real-Time Clock (LPM3.5): 0.25 µA (Typical) (3)
    • Shutdown (LPM4.5): 0.02 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 64KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns Per Word (64KB in 4 ms)
    • Unified Memory = Program + Data + Storage in One Single Space
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • 3-Channel Internal DMA
    • Real-Time Clock (RTC) With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to Seven Capture/Compare Registers Each
    • 16-Bit Cyclic Redundancy Checker (CRC)
  • High-Performance Analog
    • 16-Channel Analog Comparator
    • 12-Bit Analog-to-Digital Converter (ADC)
      With Internal Reference and Sample-and-Hold
      and up to 16 External Input Channels
    • Multifunction Input/Output Ports
      • Accessible Bit-, Byte-, and Word-Wise (in Pairs)
      • Edge-Selectable Wake From LPM on All Ports
      • Programmable Pullup and Pulldown on All Ports
    • Code Security and Encryption
      • 128-Bit or 256-Bit AES Security Encryption and Decryption Coprocessor
      • Random Number Seed for Random Number Generation Algorithms
    • Enhanced Serial Communication
      • eUSCI_A0 and eUSCI_A1 Support
        • UART With Automatic Baud-Rate Detection
        • IrDA Encode and Decode
        • SPI
      • eUSCI_B0 Supports
        • I2C With Multiple Slave Addressing
        • SPI
      • Hardware UART
    • Flexible Clock System
      • Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
      • Low-Power Low-Frequency Internal Clock Source (VLO)
      • 32-kHz Crystals (LFXT)
      • High-Frequency Crystals (HFXT)
    • Development Tools and Software
      • Free Professional Development Environments With EnergyTrace++™ Technology
      • Development Kit (MSP-TS430RGZ48C)
    • For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User’s Guide

    (1) Refer to MSP430FR5969-SP EM Lifetime Derating Chart in the Specifications Section.

    (2)Minimum supply voltage is restricted by SVS levels.

    (3)RTC is clocked by a 3.7-pF crystal.

    • Radiation-Hardness Assured
      • Extended Temperature Operation (–55°C to 105°C) (1)
      • Single Event Latchup (SEL) Immune to 72 MeV.cm2/mg at 125°C
      • Radiation Lot Acceptance Tested to 50 krad
      • 48-pin VQFN Plastic Package
      • Single Controlled Baseline
      • Extended Product Change Notification
      • Product Traceability
      • Extended Product Life Cycle
    • Embedded Microcontroller
      • 16-Bit RISC Architecture up to 16‑MHz Clock
      • Wide Supply Voltage Range
        (1.8 V to 3.6 V) (2)
    • Optimized Ultra-Low-Power Modes
      • Active Mode: Approximately 100 µA/MHz
      • Standby (LPM3 With VLO): 0.4 µA (Typical)
      • Real-Time Clock (LPM3.5): 0.25 µA (Typical) (3)
      • Shutdown (LPM4.5): 0.02 µA (Typical)
    • Ultra-Low-Power Ferroelectric RAM (FRAM)
      • Up to 64KB of Nonvolatile Memory
      • Ultra-Low-Power Writes
      • Fast Write at 125 ns Per Word (64KB in 4 ms)
      • Unified Memory = Program + Data + Storage in One Single Space
      • 1015 Write Cycle Endurance
      • Radiation Resistant and Nonmagnetic
    • Intelligent Digital Peripherals
      • 32-Bit Hardware Multiplier (MPY)
      • 3-Channel Internal DMA
      • Real-Time Clock (RTC) With Calendar and Alarm Functions
      • Five 16-Bit Timers With up to Seven Capture/Compare Registers Each
      • 16-Bit Cyclic Redundancy Checker (CRC)
    • High-Performance Analog
      • 16-Channel Analog Comparator
      • 12-Bit Analog-to-Digital Converter (ADC)
        With Internal Reference and Sample-and-Hold
        and up to 16 External Input Channels
      • Multifunction Input/Output Ports
        • Accessible Bit-, Byte-, and Word-Wise (in Pairs)
        • Edge-Selectable Wake From LPM on All Ports
        • Programmable Pullup and Pulldown on All Ports
      • Code Security and Encryption
        • 128-Bit or 256-Bit AES Security Encryption and Decryption Coprocessor
        • Random Number Seed for Random Number Generation Algorithms
      • Enhanced Serial Communication
        • eUSCI_A0 and eUSCI_A1 Support
          • UART With Automatic Baud-Rate Detection
          • IrDA Encode and Decode
          • SPI
        • eUSCI_B0 Supports
          • I2C With Multiple Slave Addressing
          • SPI
        • Hardware UART
      • Flexible Clock System
        • Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
        • Low-Power Low-Frequency Internal Clock Source (VLO)
        • 32-kHz Crystals (LFXT)
        • High-Frequency Crystals (HFXT)
      • Development Tools and Software
        • Free Professional Development Environments With EnergyTrace++™ Technology
        • Development Kit (MSP-TS430RGZ48C)
      • For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User’s Guide

      (1) Refer to MSP430FR5969-SP EM Lifetime Derating Chart in the Specifications Section.

      (2)Minimum supply voltage is restricted by SVS levels.

      (3)RTC is clocked by a 3.7-pF crystal.

      The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

      The ultra low-power architecture of the MSP430FR5969-SP showcases seven low-power modes, optimized to achieve power efficient distributed telemetry/housekeeping systems.

      The integrated mixed-signal features of the MSP430FR5969-SP make it ideally suited for distributed telemetry applications in next-generation spacecraft. The strong immunity to single-event latchup and total ionizing dose, enable the device to be used in a variety of space and radiation environments.

      The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

      The ultra low-power architecture of the MSP430FR5969-SP showcases seven low-power modes, optimized to achieve power efficient distributed telemetry/housekeeping systems.

      The integrated mixed-signal features of the MSP430FR5969-SP make it ideally suited for distributed telemetry applications in next-generation spacecraft. The strong immunity to single-event latchup and total ionizing dose, enable the device to be used in a variety of space and radiation environments.

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      Technical documentation

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      Top documentation Type Title Format options Date
      * Data sheet MSP430FR5969-SP Radiation Hardened Mixed-Signal Microcontroller datasheet (Rev. A) PDF | HTML 26 Mar 2018
      * Errata MSP430FR5969 Microcontroller Errata (Rev. AG) PDF | HTML 21 Oct 2021
      * User guide MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P) PDF | HTML 21 Apr 2020
      * Radiation & reliability report MSP430FR5969-SP Neutron Displacement Damage Characterization Radiation Report 04 Apr 2019
      * Radiation & reliability report Single-event Effects Test Report of the MSP430FR5969-SP PDF | HTML 19 Mar 2019
      * Radiation & reliability report MSP430FR5969-SP Radiation-Hardened Mixed-Signal Microcontroller TID Rad Report 06 Apr 2018
      Design guide Radiation-Hardened Space Battery Management System (BMS) Reference Design 30 Jul 2025
      Application brief DLA Approved Optimizations for QML Products (Rev. C) PDF | HTML 17 Jun 2025
      Application note Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. B) PDF | HTML 10 Jun 2025
      Selection guide TI Space Products (Rev. K) 04 Apr 2025
      More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B) 20 Feb 2025
      Application note Single-Event Effects Confidence Interval Calculations (Rev. A) PDF | HTML 19 Oct 2022
      User guide MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB) PDF | HTML 22 Sep 2022
      Application note ESD Diode Current Specification (Rev. B) PDF | HTML 23 Aug 2021
      Application note MSP430 FRAM Technology – How To and Best Practices (Rev. B) 12 Aug 2021
      Application note MSP430 System-Level ESD Considerations (Rev. B) PDF | HTML 14 Jul 2021
      User guide MSP430 MCUs Development Guide Book (Rev. A) PDF | HTML 13 May 2021
      Technical article Satellite state of health: how space-grade ICs are improving telemetry circuit des PDF | HTML 26 Jan 2021
      Application note MSP430FRBoot – Main Memory Bootloader and Over-the-Air Updates for MSP430 FRAM (Rev. E) PDF | HTML 08 Jul 2020
      Application note MSP430 System ESD Troubleshooting Guide PDF | HTML 13 Dec 2019
      E-book Radiation Handbook for Electronics (Rev. A) 21 May 2019
      Application note Software I2C on MSP430 MCUs (Rev. A) 02 Jul 2018
      Application note Random Number Generation Using MSP430FR59xx and MSP430FR69xx Microcontrollers 18 Jan 2017
      Application note General Oversampling of MSP ADCs for Higher Resolution (Rev. A) PDF | HTML 01 Apr 2016
      Application note Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A) 30 Mar 2016
      Application note MSP Code Protection Features PDF | HTML 07 Dec 2015
      User guide Crypto-Bootloader (CryptoBSL) for MSP430FR59xx and MSP430FR69xx MCUs 17 Nov 2015
      EVM User's guide MSP430FR5969 LaunchPad Development Kit (MSP-EXP430FR5969) User's Guide (Rev. B) 20 Jul 2015

      Design & development

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      Firmware

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      Reference designs

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      Package Pins CAD symbols, footprints & 3D models
      HTQFP (PHP) 48 Ultra Librarian
      VQFN (RGZ) 48 Ultra Librarian

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      Information included:
      • Fab location
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      Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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