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Product details

Parameters

Arm MHz (Max.) 720 DRAM LPDDR Arm CPU 1 Arm Cortex-A8 USB 4 SPI 4 I2C 3 Display type 1 LCD Operating temperature range (C) -40 to 105, 0 to 90 Serial I/O USB, I2C, McBSP, McSPI, UART UART 3 open-in-new Find other Other Sitara processors

Package | Pins | Size

FC/CSP (CUS) 423 256 mm² 16 x 16 POP-FCBGA (CBB) 515 144 mm² 12 x 12 open-in-new Find other Other Sitara processors

Features

  • OMAP3 Devices:
    • OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 720-MHz ARM® Cortex™-A8 Core
      • NEON™ SIMD Coprocessor
    • PowerVR® SGX™ Graphics Accelerator
      • Tile-Based Architecture Delivering up to 1 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine-Grained Task Switching, Load Balancing, and Power Management
      • Programmable High-Quality Image Anti-Aliasing
    • Fully Software-Compatible with ARM9™
    • Commercial and Extended Temperature Grades
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • TrustZone®
      • Thumb®-2
      • MMU Enhancements
    • In-Order, Dual-Issue, Superscalar Microprocessor Core
    • NEON Multimedia Architecture
    • Over 2x Performance of ARMv6 SIMD
    • Supports Both Integer and Floating-Point SIMD
    • Jazelle® RCT Execution Environment Architecture
    • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
    • Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
  • ARM Cortex-A8 Memory Architecture:
    • -KB Instruction Cache (4-Way Set-Associative)
    • -KB Data Cache (4-Way Set-Associative)
    • -KB L2 Cache
  • 112KB of ROM
  • 64KB of Shared SRAM
  • Endianess:
    • ARM Instructions – Little Endian
    • ARM Data – Configurable
  • External Memory Interfaces:
    • General Purpose Memory Controller (GPMC)
      • 16-Bit-Wide Multiplexed Address and Data Bus
      • Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
      • Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
  • System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
  • Camera Image Signal Processor (ISP)
    • CCD and CMOS Imager Interface
    • Memory Data Input
    • BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
    • Glueless Interface to Common Video Decoders
    • Resize Engine
      • Resize Images From 1/4x to 4x
      • Separate Horizontal and Vertical Control
  • Display Subsystem
    • Parallel Digital Output
      • Up to 24-Bit RGB
      • HD Maximum Resolution
      • Supports Up to 2 LCD Panels
      • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
    • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
      • Composite NTSC and PAL Video
      • Luma and Chroma Separate Video (S-Video)
    • Rotation 90-, 180-, and 270-Degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-Bit Alpha Blending
  • Serial Communication
    • 5 Multichannel Buffered Serial Ports (McBSPs)
      • 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
      • 5-KB Transmit and Receive Buffer (McBSP2)
      • SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
      • Direct Interface to I2S and PCM Device and TDM Buses
      • 128-Channel Transmit and Receive Mode
    • Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
    • High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
    • High-, Full-, and Low-Speed Multiport USB Host Subsystem
      • 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
    • One HDQ™/1-Wire® Interface
    • UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
    • Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
  • Removable Media Interfaces:
    • Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
  • Comprehensive Power, Reset, and Clock Management
    • SmartReflex™ Technology
    • Dynamic Voltage and Frequency Scaling (DVFS)
  • Test Interfaces
    • IEEE 1149.1 (JTAG) Boundary-Scan Compatible
    • ETM Interface
    • Serial Data Transport Interface (SDTI)
  • 12 32-Bit General-Purpose Timers
  • 2 32-Bit Watchdog Timers
  • 1 32-Bit 32-kHz Sync Timer
  • Up to General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • 5-nm CMOS Technologies
  • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
  • Discrete Memory Interface
  • Packages:
  • 1.8-V I/O and 3.0-V (MMC1 Only),


    Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.
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Description

devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

  • Streaming video
  • Video conferencing
  • High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

  • Linux®
  • Windows® CE
  • Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

  • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
  • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP35 device only)
  • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
  • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
  • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

  • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
  • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP35 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).

This data manual presents the electrical and mechanical specifications for the OMAP35 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP35 applications processors unless otherwise indicated. This data manual consists of the following sections:

  • Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
  • Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
  • Section 4: Clock Specifications input and output clocks, DPLL and DLL
  • Section 5: Video Dac Specifications
  • Section 6: Timing Requirements and Switching Characteristics
  • Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging
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Download

No design support from TI available

This product does not have ongoing design support from TI for new projects, such as new content or software updates. If available, you will find relevant collateral, software and tools in the product folder. You can also search for archived information in the TI E2ETM support forums.

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 23
Type Title Date
* Datasheet OMAP3515 and OMAP3503 Applications Processors datasheet (Rev. H) Oct. 10, 2013
* Errata OMAP3530/25/15/03 Applications Processor Silicon Errata (Rev. F) Oct. 12, 2010
Technical articles How to affordably add EtherNet/IP, EtherCAT and PROFINET to an autonomous factory Aug. 24, 2020
User guides SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) Jun. 01, 2020
Application notes (Cancelled - see the B revision, create by mistake 14-may-2009) (Rev. C) Mar. 03, 2020
Technical articles Designing smarter remote terminal units for microgrids Oct. 02, 2019
Technical articles Security versus functional safety: a view from the Processor Software Development Kit May 31, 2019
Application notes OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles Mar. 20, 2019
Technical articles Simplified software development through the Processor SDK and tools Oct. 02, 2018
User guides How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS Sep. 24, 2018
User guides SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. U) Feb. 07, 2018
Application notes PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) Nov. 01, 2013
User guides Delta for OMAP35x Technical Reference Manual Version X to Version Y (Rev. Y) Dec. 10, 2012
User guides OMAP35x Technical Reference Manual (Rev. Y) Dec. 10, 2012
Application notes PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II Jun. 23, 2010
Application notes PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I Jun. 23, 2010
Application notes Migrating from OMAP3530 to AM37x Jun. 03, 2010
Application notes Migrating from OMAP3530 to AM35x May 24, 2010
User guides OMAP35x Peripherals Overview Reference Guide (Rev. A) Jan. 20, 2010
Application notes OMAP35x Linux PSP Data Sheet Oct. 16, 2009
User guides Powering OMAP35x with TPS65073x Oct. 13, 2009
Application notes Powering OMAP™3 With TPS6235x: Design-In Guide Dec. 03, 2008
Application notes OMAP35x 0.65mm Pitch Layout Methods (Rev. B) Jun. 26, 2008

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Software development

SOFTWARE DEVELOPMENT KITS (SDK) Download
Android Development Kit for Sitara Microprocessors
ANDROIDSDK-SITARA Although originally designed for mobile handsets, the Android Operating System offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system  that is ready for (...)
Features

Although originally designed for mobile handsets, the Android Operating System offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system  that is ready for (...)

SOFTWARE DEVELOPMENT KITS (SDK) Download
Linux Digital Video Software Development Kit (DVSDK) for OMAP3530/3525 Digital Media Processors
LINUXDVSDK-OMAP3530 The Linux Digital Video Software Development Kit (DVSDK) enables OMAP35x system integrators to quickly develop Linux-based multimedia applications that can be easily ported across different devices in the OMAP35x generation, including OMAP3530 and OMAP3525 application processors. The DVSDK combines (...)
Features

The OMAP35x Linux DVSDK is a free non-commercial Linux that comes complete with everything a user needs to get started quickly and can be shipped in production systems.  The Quick Start Guide should allow users to connect the hardware and start playing with GUI based demos which demonstrate the (...)

CODE EXAMPLES & DEMOS Download
DEMO - OMAP35x Application Example & Demo Code
DEMOAPP-OMAP35X Free Example Code - TI provides proof-of-concept application code to demonstrate some of the hardware and software capabilities of its devices.

 

Click GET SOFTWARE to access Application Demo and Documentation, based on the OMAP35x EVM (evaluation module).

DEBUG PROBES Download
XDS200 USB Debug Probe
TMDSEMU200-U The Spectrum Digital XDS200 is the first model of the XDS200 family of debug probes (emulators) for TI processors. The XDS200 family features a balance of low cost with good performance between the super low cost XDS110 and the high performance XDS560v2, while supporting a wide variety of standards (...)
295
Features

The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)

DEBUG PROBES Download
XDS560v2 System Trace USB Debug Probe
TMDSEMU560V2STM-U The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).

The (...)

995
Features

XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)

DEBUG PROBES Download
XDS560v2 System Trace USB & Ethernet Debug Probe
TMDSEMU560V2STM-UE The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).

The (...)

1495
Features
  • XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)

IDES, CONFIGURATION, COMPILERS & DEBUGGERS Download
Code Composer Studio (CCS) Integrated Development Environment (IDE) for Sitara ARM Processors
CCSTUDIO-SITARA

Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor (...)

PROGRAMMING TOOLS Download
FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices
FLASHTOOL — Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

SOFTWARE CODECS Download
CODECS - Video and Speech- C64x+-based Devices (OMAP35x, C645x, C647x, DM646, DM644x, DM643x)
C64XPLUSCODECS TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes are on (...)
Features

For best design results, find the codec(s) optimized for your platform. If none are available, click GET SOFTWARE button (above) for codecs optimized for TI C64x+ core-based devices (i.e. most devices in the OMAP35x, TMS320C645x, TMS320C647x, TMS320DM646x, TMS320DM644x and TMS320DM643x families).

  • For (...)
SOFTWARE CODECS Download
CODECS - Optimized for OMAP35x Processors
OMAP35XCODECS TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into audio, video and voice applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes (...)
Features

OMAP35x Codecs are optimized for use on OMAP3525 and OMAP3530 processors. For best design results, use these. If you seek additional TI codecs, find those optimized for TI C64x+ core-based devices (i.e. most devices in the OMAP35x, TMS320C645x, TMS320C647x, TMS320DM646x, TMS320DM644x and (...)

Design tools & simulation

SIMULATION MODELS Download
SPRM312B.ZIP (10 KB) - BSDL Model
SIMULATION MODELS Download
SPRM313C.ZIP (11 KB) - BSDL Model
SIMULATION MODELS Download
SPRM319B.ZIP (1537 KB) - IBIS Model
SIMULATION MODELS Download
SPRM320A.ZIP (1575 KB) - IBIS Model
SIMULATION MODELS Download
SPRM321A.ZIP (1559 KB) - IBIS Model
SIMULATION MODELS Download
SPRM473.ZIP (10 KB) - BSDL Model
CALCULATION TOOLS Download
Pin mux tool
PINMUXTOOL The PinMux Utility is a software tool which provides a Graphical User Interface for configuring pin multiplexing settings, resolving conflicts and specifying I/O cell characteristics for TI MPUs. Results are output as C header/code files that can be imported into software development kits (SDKs) or (...)
CALCULATION TOOLS Download
Features

Power Estimation Tool (PET) provides users the ability to gain insight in to the power consumption of select TI processors. The tool includes the ability for the user to choose multiple application scenarios and understand the power consumption as well as how advanced power saving techniques can be (...)

SCHEMATICS Download
SLUA480.PDF (129 KB)

CAD/CAE symbols

Package Pins Download
FCBGA (CUS) 423 View options
POP-FCBGA (CBB) 515 View options
POP-FCBGA (CBC) 515 View options

Ordering & quality

Support & training

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