SN74ACT74-EP

ACTIVE

Product details

Number of channels (#) 2 Technology Family ACT Supply voltage (Min) (V) 4.5 Supply voltage (Max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock Frequency (Max) (MHz) 90 IOL (Max) (mA) 24 IOH (Max) (mA) -24 ICC (Max) (uA) 20 Features Balanced outputs, Very high speed (tpd 5-10ns), Positive input clamp diode
Number of channels (#) 2 Technology Family ACT Supply voltage (Min) (V) 4.5 Supply voltage (Max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock Frequency (Max) (MHz) 90 IOL (Max) (mA) 24 IOH (Max) (mA) -24 ICC (Max) (uA) 20 Features Balanced outputs, Very high speed (tpd 5-10ns), Positive input clamp diode
SOIC (D) 14 52 mm² 8.65 x 6
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 4.5-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 10.5 ns at 5 V
  • Inputs Are TTL-Voltage Compatible

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 4.5-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 10.5 ns at 5 V
  • Inputs Are TTL-Voltage Compatible

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74ACT74-EP is a dual positive-edge-triggered D-type flip-flop.

A low level at the preset (PRE\) or clear (CLR\) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE\ and CLR\ are inactive (high), data at the data (D) input meeting the setup-time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at D can be changed without affecting the levels at the outputs.

The SN74ACT74-EP is a dual positive-edge-triggered D-type flip-flop.

A low level at the preset (PRE\) or clear (CLR\) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE\ and CLR\ are inactive (high), data at the data (D) input meeting the setup-time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at D can be changed without affecting the levels at the outputs.

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Technical documentation

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Type Title Date
* Data sheet SN74ACT74-EP datasheet 30 Sep 2003
* VID SN74ACT74-EP VID V6204725 21 Jun 2016
* Radiation & reliability report SN74ACT74MDREP Reliability Report 04 Jun 2012
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dec 2022
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

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