SN74AHCT574

ACTIVE

Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs

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Product details

Parameters

Channels (#) 8 Technology Family AHCT VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock Frequency (Max) (MHz) 70 IOL (Max) (mA) 8 IOH (Max) (mA) -8 ICC (Max) (uA) 40 Features Balanced outputs, Very high speed (tpd 5-10ns) open-in-new Find other D-type flip-flop

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 42 mm² 6.5 x 6.4 TVSOP (DGV) 20 32 mm² 5 x 6.4 open-in-new Find other D-type flip-flop

Features

  • Inputs are TTL-Voltage Compatible
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • On Products Compliant to MIL-PRF-38535,
    All Parameters are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters.
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
open-in-new Find other D-type flip-flop

Description

The SNx4AHCT574 devices are octal edge-triggered D-type flip-flops that feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads.

open-in-new Find other D-type flip-flop
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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SNx4AHCT574 Octal Transparent D-Type Latches With 3-State Outputs datasheet (Rev. M) Sep. 03, 2014
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application note Power-Up Behavior of Clocked Devices (Rev. A) Feb. 06, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) Dec. 02, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
User guide AHC/AHCT Designer's Guide February 2000 (Rev. D) Feb. 24, 2000
More literature Military Advanced High-Speed CMOS Logic (AHC/AHCT) Apr. 01, 1998
More literature Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) Apr. 01, 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Live Insertion Oct. 01, 1996

Design & development

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Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

CAD/CAE symbols

Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options
TVSOP (DGV) 20 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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