SN74AHCT74Q-Q1

ACTIVE

Automotive Catalog Dual Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset

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Automotive Catalog Dual Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset

SN74AHCT74Q-Q1

ACTIVE

Product details

Parameters

Channels (#) 2 Technology Family AHCT VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock Frequency (Max) (MHz) 70 IOL (Max) (mA) 8 IOH (Max) (mA) -8 ICC (Max) (uA) 20 Features Balanced outputs, Very high speed (tpd 5-10ns) open-in-new Find other D-type flip-flop

Package | Pins | Size

SOIC (D) 14 52 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 open-in-new Find other D-type flip-flop

Features

  • Qualified for Automotive Applications
  • Inputs Are TTL-Voltage Compatible
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015;
    Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)

EPIC is a trademark of Texas Instruments.

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Description

The SN74AHCT74Q is a dual positive-edge-triggered D-type flip-flop.

A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet Dual Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset datasheet (Rev. B) Apr. 24, 2008
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application note Power-Up Behavior of Clocked Devices (Rev. A) Feb. 06, 2015
More literature Automotive Logic Devices Brochure Aug. 27, 2014
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) Dec. 02, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
User guide AHC/AHCT Designer's Guide February 2000 (Rev. D) Feb. 24, 2000
More literature Military Advanced High-Speed CMOS Logic (AHC/AHCT) Apr. 01, 1998
More literature Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) Apr. 01, 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Live Insertion Oct. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

CAD/CAE symbols

Package Pins Download
SOIC (D) 14 View options
TSSOP (PW) 14 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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