Product details

Technology Family AUP Supply voltage (Min) (V) 0.8 Supply voltage (Max) (V) 3.6 Number of channels (#) 1 IOL (Max) (mA) 4 IOH (Max) (mA) 0 ICC (Max) (uA) 10 Input type Standard CMOS Output type Open-Drain Features Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Rating Catalog
Technology Family AUP Supply voltage (Min) (V) 0.8 Supply voltage (Max) (V) 3.6 Number of channels (#) 1 IOL (Max) (mA) 4 IOH (Max) (mA) 0 ICC (Max) (uA) 10 Input type Standard CMOS Output type Open-Drain Features Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Rating Catalog
DSBGA (YFP) 4 0 mm² .8 x .8 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 5 2 mm² 1.65 x 1.2 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DPW) 5 1 mm² .8 x .8 X2SON (DSF) 6 1 mm² 1 x 1
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 1 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial Power-Down-Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 3.6 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 1 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial Power-Down-Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 3.6 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see

AUP – The Lowest-Power Family and Excellent Signal Integrity).

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see

AUP – The Lowest-Power Family and Excellent Signal Integrity).

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Technical documentation

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Type Title Date
* Data sheet SN74AUP1G06 Low-Power Single Inverter With Open-Drain Outputs datasheet (Rev. E) 26 Mar 2018
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Application note Designing and Manufacturing with TI's X2SON Packages 23 Aug 2017
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding Schmitt Triggers 21 Sep 2011
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic EVM supporting 5 through 8 pin DCK, DCT, DCU, DRL, and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
In stock
Limit: 5
Simulation model

SN74AUP1G06 IBIS Model (Rev. A)

SCEM440A.ZIP (47 KB) - IBIS Model
Simulation model

SN74AUP1G06 Behavioral SPICE Model

SCEM694.ZIP (7 KB) - PSpice Model
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This display reference design features the DLP Pico™ 0.3-inch TRP HD 720p display chipset and is implemented in the DLP LightCrafter™ Display 3010-G2 evaluation module (EVM). It enables the use of HD resolution for projection display applications such as mobile smart TV, virtual (...)
Reference designs

TIDA-00570 — High Speed DLP Sub-system for Industrial 3D Printing and Digital Lithography Reference Design

The High Speed DLP® Sub-system Reference Design provides system-level DLP development board designs for industrial Digital Lithography and 3D Printing applications that require high resolution, superior speed and production reliability. The system design offers maximum throughput by integrating (...)
Package Pins Download
DSBGA (YFP) 4 View options
SC70 (DCK) 5 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 5 View options
SOT-5X3 (DRL) 5 View options
X2SON (DPW) 5 View options

Ordering & quality

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