Product details

Technology Family AUP Supply voltage (Min) (V) 0.8 Supply voltage (Max) (V) 3.6 Number of channels (#) 1 IOL (Max) (mA) 4 ICC (Max) (uA) 0.9 IOH (Max) (mA) 0 Input type Standard CMOS Output type Open-Drain Features Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Rating Catalog
Technology Family AUP Supply voltage (Min) (V) 0.8 Supply voltage (Max) (V) 3.6 Number of channels (#) 1 IOL (Max) (mA) 4 ICC (Max) (uA) 0.9 IOH (Max) (mA) 0 Input type Standard CMOS Output type Open-Drain Features Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Rating Catalog
DSBGA (YFP) 4 0 mm² .8 x .8 DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 5 2 mm² 1.65 x 1.2 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DPW) 5 1 mm² .8 x .8 X2SON (DSF) 6 1 mm² 1 x 1
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 1 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typ at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 3.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 1 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typ at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 3.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

The SN74AUP1G07 device is a single buffer gate with open drain output that operates from 0.8 V to 3.6 V.

The SN74AUP1G07 device is a single buffer gate with open drain output that operates from 0.8 V to 3.6 V.

Download

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 7
Type Title Date
* Data sheet SN74AUP1G07 Low-Power Single Buffer/Driver With Open-Drain Outputs datasheet (Rev. J) 13 Dec 2013
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Application note Designing and Manufacturing with TI's X2SON Packages 23 Aug 2017
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding Schmitt Triggers 21 Sep 2011
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic EVM supporting 5 through 8 pin DCK, DCT, DCU, DRL, and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
In stock
Limit: 5
Simulation model

SN74AUP1G07 IBIS Model

SCEM443.ZIP (48 KB) - IBIS Model
Simulation model

SN74AUP1G07 Behavioral SPICE Model

SCEM691.ZIP (7 KB) - PSpice Model
Reference designs

TIDA-080002 — Ultra Mobile, Low Power DLP® Pico™ qHD Display Reference Design

The 0.23 qHD DLP chipset is an affordable platform enabling the use of DLP technology with embedded host processor. This chipset is incorporated in to this reference design to enable a low power, on-demand free-form sub-system display for a variety of applications.
Reference designs

TIDA-01226 — Compact Full HD 1080p (up to 16 Amps) Projection Display Reference Design Using DLP Pico Technology

This reference design, featuring the DLP Pico™ 0.47-inch TRP Full-HD 1080p display chipset and implemented in the DLP LightCrafter Display 4710 G2 evaluation module (EVM), enables use of full HD resolution for projection display applications such as accessory projectors, screenless displays, (...)
Reference designs

TIDA-01571 — Portable, Low Power HD Display with Increased Brightness Reference Design Using DLP® Technology

This display reference design features the DLP Pico™ 0.3-inch TRP HD 720p display chipset and is implemented in the DLP LightCrafter™ Display 3010-G2 evaluation module (EVM). It enables the use of HD resolution for projection display applications such as mobile smart TV, virtual (...)
Reference designs

TIDA-00570 — High Speed DLP Sub-system for Industrial 3D Printing and Digital Lithography Reference Design

The High Speed DLP® Sub-system Reference Design provides system-level DLP development board designs for industrial Digital Lithography and 3D Printing applications that require high resolution, superior speed and production reliability. The system design offers maximum throughput by integrating (...)
Package Pins Download
DSBGA (YFP) 4 View options
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 5 View options
SOT-5X3 (DRL) 5 View options
X2SON (DPW) 5 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos