SN74CBTLV3253-Q1

ACTIVE

Product details

There are no parameters available for this product.
SOT-23-THN (DYY) 16 8.4 mm² (4.2 mm × 2 mm)
  • Functionally Equivalent to QS3253
  • 5Ω Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100mA Per JESD 78, Class II
  • Functionally Equivalent to QS3253
  • 5Ω Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100mA Per JESD 78, Class II

The SN74CBTLV3253-Q1 device is a dual 1-of-4 high-speed FET multiplexer and demultiplexer. The low ON-state resistance of the switch allows connections to be made with minimal propagation delay.

The select (S0, S1) inputs control the data flow. The FET multiplexers/demultiplexers are disabled when the associated output-enable ( OE) input is high.

The SN74CBTLV3253-Q1 device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current cannot backflow through the device when it is powered down. The device has isolation during power off.

The SN74CBTLV3253-Q1 device is a dual 1-of-4 high-speed FET multiplexer and demultiplexer. The low ON-state resistance of the switch allows connections to be made with minimal propagation delay.

The select (S0, S1) inputs control the data flow. The FET multiplexers/demultiplexers are disabled when the associated output-enable ( OE) input is high.

The SN74CBTLV3253-Q1 device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current cannot backflow through the device when it is powered down. The device has isolation during power off.

There are no details available for this product.
Download View video with transcript Video

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Supported products & hardware
In stock
Limit:
??asset.out-of-stock-ti_en_US??
Not available
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Supported products & hardware
In stock
Limit:
??asset.out-of-stock-ti_en_US??
Not available
Package Pins CAD symbols, footprints & 3D models
SOT-23-THN (DYY) 16 Ultra Librarian

Ordering & quality

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos