These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight flip-flops of the ´F374 are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels that were set up at the data (D) inputs.
A buffered output enable (
) input can be used to place the eight outputs in either
a normal logic state (high or low) or a high-impedance state. In the
high-impedance state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and the increased drive
provide the capability to drive bus lines without need for interface
or pullup components.
The output enable ()
input does not affect internal operations of the flip-flop. Old data
can be retained or new data can be entered while the outputs are in
the high-impedance state.
The SN74F374 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F374 is characterized for operation from 0°C to 70°C.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet (Rev. A) | 01 Oct 1993 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 15 Dec 2022 | |
| Selection guide | Logic Guide (Rev. AB) | 12 Jun 2017 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 02 Dec 2015 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 16 Jan 2007 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 Jul 2004 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 29 Aug 2002 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 01 Aug 1997 | ||
| Application note | Designing With Logic (Rev. C) | 01 Jun 1997 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 01 Oct 1996 |
For additional terms or required resources, click any title below to view the detail page where available.
The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,
| Package | Pins | Download |
|---|---|---|
| PDIP (N) | 20 | View options |
| SOIC (DW) | 20 | View options |
| SOP (NS) | 20 | View options |
| SSOP (DB) | 20 | View options |
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