SN74HC574

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Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs

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Product details

Parameters

Channels (#) 8 Technology Family HC VCC (Min) (V) 2 VCC (Max) (V) 6 Input type Standard CMOS Output type 3-State Clock Frequency (Max) (MHz) 28 IOL (Max) (mA) 7.8 IOH (Max) (mA) -7.8 ICC (Max) (uA) 80 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode open-in-new Find other D-type flip-flop

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 42 mm² 6.5 x 6.4 open-in-new Find other D-type flip-flop

Features

  • Wide Operating Voltage Range of 2 V to 6 V
  • High-Current 3-State Noninverting Outputs Drive Bus Lines Directly or Up To 15 LSTTL Loads
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 22 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Bus-Structured Pinout

open-in-new Find other D-type flip-flop

Description

These octal edge-triggered D-type flip-flops feature 3-state outputs designed specifically for bus driving. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight flip-flops enter data on the low-to-high transition of the clock (CLK) input.

A buffered output-enable (OE)\ input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.

OE\ does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

open-in-new Find other D-type flip-flop
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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN54HC574, SN74HC574 datasheet (Rev. F) Aug. 13, 2003
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application note Power-Up Behavior of Clocked Devices (Rev. A) Feb. 06, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions May 01, 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc Apr. 01, 1996

Design & development

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Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

CAD/CAE symbols

Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options

Ordering & quality

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