Product details
Parameters
Package | Pins | Size
Features
- Available in the Texas Instruments NanoFree Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Provides Down Translation to VCC
- Max tpd of 3.8 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
- Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged Device Model (C101)
Description
The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Technical documentation
= Top documentation for this product selected by TI
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Design tools & simulation
SCEM368A.ZIP (44 KB) - IBIS Model
SCEM641.ZIP (8 KB) - PSpice Model
Reference designs
TIDA-010025 — This reference design realizes a reinforced isolated three-phase inverter subsystem using isolated IGBT gate drivers and isolated current/voltage sensors. The UCC23513 gate driver used has a 6-pin wide body package with optical LED emulated inputs which enables its use as pin-to-pin replacement to (...)
Design files
-
download TIDA-010025 BOM Files.zip (233KB) -
download TIDA-010025 Assembly Files.zip (1084KB) -
download TIDA-010025 Layer Plots.zip (2614KB) -
download TIDA-010025 CAD Files.zip (3698KB) -
download TIDA-010025 Gerber.zip (1507KB)
TIDA-01540 — The TIDA-01540 reference design reduces system cost and enables a compact design for a reinforced isolated 10kW three phase inverter. A lower system cost and compact form factor is achieved by using a dual gate driver in a single package and bootstrap configuration to generate floating voltages for (...)
Design files
-
download TIDA-01540 BOM.pdf (98KB) -
download TIDA-01540 Assembly Drawing.pdf (538KB) -
download TIDA-01540 PCB.pdf (3057KB) -
download TIDA-01540 Gerber.zip (440KB) -
download TIDA-01540 CAD Files (Rev. A).zip (4705KB)
TIDA-01541 — The TIDA-01541 reference design reduces system cost and enables a compact design for isolated phase current and DC link voltage measurement in three-phase inverters, while achieving high bandwidth and sensing accuracy. The output of the isolated amplifiers is interfaced to the internal ADC of the (...)
Design files
-
download TIDA-01541 BOM.pdf (98KB) -
download TIDA-01541 Assembly Drawing.pdf (538KB) -
download TIDA-01541 PCB.pdf (3057KB) -
download TIDA-01541 Gerber.zip (439KB) -
download TIDA-01541 CAD Files (Rev. A).zip (5143KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZP) | 6 | View options |
SC70 (DCK) | 6 | View options |
SON (DRY) | 6 | View options |
SON (DSF) | 6 | View options |
SOT-23 (DBV) | 6 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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