Product details

Technology Family LVC Supply voltage (Min) (V) 1.65 Supply voltage (Max) (V) 5.5 Number of channels (#) 1 Inputs per channel 3 IOL (Max) (mA) 32 IOH (Max) (mA) -32 Input type Standard CMOS Output type Push-Pull Features Partial power down (Ioff), Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Data rate (Max) (Mbps) 100 Rating Catalog
Technology Family LVC Supply voltage (Min) (V) 1.65 Supply voltage (Max) (V) 5.5 Number of channels (#) 1 Inputs per channel 3 IOL (Max) (mA) 32 IOH (Max) (mA) -32 Input type Standard CMOS Output type Push-Pull Features Partial power down (Ioff), Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Data rate (Max) (Mbps) 100 Rating Catalog
DSBGA (YZP) 6 2 mm² .928 x 1.428 SOT-23 (DBV) 6 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DSF) 6 1 mm² 1 x 1
  • Available in the Texas Instruments NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 3.8 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged Device Model (C101)

  • Available in the Texas Instruments NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 3.8 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged Device Model (C101)

The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Technical documentation

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Type Title Date
* Data sheet SN74LVC1G10 datasheet (Rev. E) 11 Jan 2012
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
More literature Logic Cross-Reference (Rev. A) 07 Oct 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic EVM supporting 5 through 8 pin DCK, DCT, DCU, DRL, and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
In stock
Limit: 5
Simulation model

SN74LVC1G10 IBIS Model (Rev. A)

SCEM368A.ZIP (44 KB) - IBIS Model
Simulation model

SN74LVC1G10 Behavioral SPICE Model

SCEM641.ZIP (8 KB) - PSpice Model
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TIDA-01540 — Three-Phase Inverter Reference Design Using Gate Driver With Built-in Dead Time Insertion

The TIDA-01540 reference design reduces system cost and enables a compact design for a reinforced isolated 10kW three phase inverter. A lower system cost and compact form factor is achieved by using a dual gate driver in a single package and bootstrap configuration to generate floating voltages (...)
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TIDA-01541 — High-Bandwidth Phase Current and DC-Link Voltage Sensing Reference Design for Three-Phase Inverters

The TIDA-01541 reference design reduces system cost and enables a compact design for isolated phase current and DC link voltage measurement in three-phase inverters, while achieving high bandwidth and sensing accuracy. The output of the isolated amplifiers is interfaced to the internal ADC of the (...)
Package Pins Download
DSBGA (YZP) 6 View options
SC70 (DCK) 6 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 6 View options

Ordering & quality

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