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SN74LVC1G10

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Single 3-input, 1.65-V to 5.5-V NAND gate

Data sheet
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Single 3-input, 1.65-V to 5.5-V NAND gate

SN74LVC1G10

ACTIVE
Data sheet Order now

Product details

Parameters

Technology Family LVC Supply voltage (Min) (V) 1.65 Supply voltage (Max) (V) 5.5 Channels (#) 1 Inputs per channel 3 IOL (Max) (mA) 32 IOH (Max) (mA) -32 Input type Standard CMOS Output type Push-Pull Features Partial power down (Ioff), Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Data rate (Max) (Mbps) 100 Rating Catalog Operating temperature range (C) -40 to 125, -40 to 85 open-in-new Find other NAND gate

Package | Pins | Size

DSBGA (YZP) 6 2 mm² .928 x 1.428 SOT-23 (DBV) 6 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DSF) 6 1 mm² 1 x 1 open-in-new Find other NAND gate

Features

  • Available in the Texas Instruments NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 3.8 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged Device Model (C101)

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Description

The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN74LVC1G10 datasheet (Rev. E) Jan. 11, 2012
Technical articles How to keep your motor running safely Jun. 04, 2020
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
User guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
View details

Design tools & simulation

SIMULATION MODEL Download
SCEM368A.ZIP (44 KB) - IBIS Model
SIMULATION MODEL Download
SCEM641.ZIP (8 KB) - PSpice Model

Reference designs

REFERENCE DESIGNS Download
Three-phase inverter reference design for 200-480 VAC drives with opto-emulated input gate drivers
TIDA-010025 — This reference design realizes a reinforced isolated three-phase inverter subsystem using isolated IGBT gate drivers and isolated current/voltage sensors. The UCC23513 gate driver used has a 6-pin wide body package with optical LED emulated inputs which enables its use as pin-to-pin replacement to (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Three-Phase Inverter Reference Design Using Gate Driver With Built-in Dead Time Insertion
TIDA-01540 — The TIDA-01540 reference design reduces system cost and enables a compact design for a reinforced isolated 10kW three phase inverter. A lower system cost and compact form factor is achieved by using a dual gate driver in a single package and bootstrap configuration to generate floating voltages for (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
High-Bandwidth Phase Current and DC-Link Voltage Sensing Reference Design for Three-Phase Inverters
TIDA-01541 — The TIDA-01541 reference design reduces system cost and enables a compact design for isolated phase current and DC link voltage measurement in three-phase inverters, while achieving high bandwidth and sensing accuracy. The output of the isolated amplifiers is interfaced to the internal ADC of the (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 6 View options
SC70 (DCK) 6 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 6 View options

Ordering & quality

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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