SN74LVT574

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3.3-V ABT Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs

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Product details

Parameters

Technology Family LVT Input type TTL-Compatible CMOS Output type 3-State VCC (Min) (V) 2.7 VCC (Max) (V) 3.6 Channels (#) 8 Clock Frequency (Max) (MHz) 150 ICC (uA) 5000 IOL (Max) (mA) 24 IOH (Max) (mA) -24 Features Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs, Bus hold Rating Catalog open-in-new Find other D-type flip-flop

Package | Pins | Size

SOIC (DW) 20 132 mm² 12.8 x 10.3 TSSOP (PW) 20 42 mm² 6.5 x 6.4 open-in-new Find other D-type flip-flop

Features

  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model(C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Support Live Insertion
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic (J) DIPs
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Description

These octal flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The eight flip-flops of the ´LVT574 are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.

A buffered output-enable input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT574 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT574 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT574 is characterized for operation from -40°C to 85°C.

 

 

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Technical documentation

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Type Title Date
* Datasheet 3.3-V ABT Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet (Rev. D) Jul. 01, 1995
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application notes 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application notes Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Selection guides Advanced Bus Interface Logic Selection Guide Jan. 09, 2001
Application notes LVT-to-LVTH Conversion Dec. 08, 1998
Application notes LVT Family Characteristics (Rev. A) Mar. 01, 1998
Application notes Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application notes Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application notes Live Insertion Oct. 01, 1996
Application notes Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
$10.00
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

CAD/CAE symbols

Package Pins Download
SOIC (DW) 20 View options
TSSOP (PW) 20 View options

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