Top

Product details

Parameters

We are not able to display this information. Please refer to the product data sheet.

Package | Pins | Size

SOIC (D) 8 19 mm² 4.9 x 3.9 VSON (DRB) 8 9 mm² 3 x 3 open-in-new Find other CAN & LIN transceivers & SBCs

Features

  • AEC-Q100 Qualified for automotive applications
    • Temperature grade 1: –40°C to 125°C TA
    • Device HBM certification level: ±8 kV
    • Device CDM certification level: ±1.5 kV
  • Compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO/DIS 17987–4.2 (See SLLA490)
  • Conforms to SAE J2602 recommended practice for LIN (See SLLA490)
  • Supports 24 V applications
  • LIN transmit data rate up to 20-kbps
  • Wide operating ranges
    • 4-V to 48-V Supply voltage
    • ±60-V LIN bus fault protection
  • Sleep mode: ultra-low current consumption allows wake-up event from:
    • LIN bus
    • Local wake up through EN
  • Power up and down glitch free operation
  • Protection features:
    • Under voltage protection on VSUP
    • TXD Dominant time out protection (DTO)
    • Thermal shutdown protection
    • Unpowered node or ground disconnection failsafe at system level.
  • Available in SOIC (8) and leadless VSON (8) packages with improved automated optical inspection (AOI) capability
open-in-new Find other CAN & LIN transceivers & SBCs

Description

The TLIN2029-Q1 is a local interconnect network (LIN) physical layer transceiver with integrated wake-up and protection features, compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO/DIS 17987–4.2 standards. LIN is a single-wire bidirectional bus typically used for low speed in-vehicle networks using data rates up to 20 kbps. The TLIN2029-Q1 is designed to support 24-V applications with wider operating voltage and additional bus-fault protection. The LIN receiver supports data rates up to 100 kbps for faster in-line programming. The TLIN2029-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal using a current-limited wave-shaping driver which reduces electromagnetic emissions (EME). The receiver converts the data stream to logic level signals that are sent to the microprocessor through the open-drain RXD pin. Ultra-low current consumption is possible using the sleep mode which allows wake-up via LIN bus or pin.

The integrated resistor, electrostatic discharge (ESD) and fault protection allows designers to save board space in their applications.

open-in-new Find other CAN & LIN transceivers & SBCs
Download
Similar products you might be interested in
Pin-for-pin with same functionality to the compared device.
NEW TLIN2029A-Q1 ACTIVE Fault protected local interconnect network (LIN) transceiver with dominant state timeout Pin-to-pin update with improved performance

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 8
Type Title Date
* Data sheet TLIN2029-Q1 Fault Protected Local Interconnect Network (LIN) Transceiver with Dominant State Timeout datasheet (Rev. E) May 20, 2020
* Errata TLIN1029-Q1 and TLIN2029-Q1 Duty Cycle Over VSUP May 22, 2020
User guide SPI to CAN FD SBC + LIN Transceiver BoosterPack User's Guide Apr. 01, 2019
Application note CAN and LIN transceiver low-power modes Feb. 25, 2019
Technical article Transients in 24V automobiles Feb. 28, 2018
Application note LIN Protocol and Physical Layer Requirements Feb. 28, 2018
Technical article Local Interconnect Network – the last mile network Jan. 18, 2018
User guide TLIN2029-Q1 EVM User's Guide Sep. 18, 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
149
Description
The SPI to CAN FD SBC + LIN BoosterPack™ plug-in module features the TCAN4550-Q1 CAN FD controller with integrated transceiver providing microcontrollers without an integrated CAN FD controller, or those needing additional channels, access to CAN FD applications through a SPI interface (...)
Features
  • TCAN4550-Q1 CAN FD controller with integrated transceiver and SPI interface
  • TLIN2029-Q1 fault protected LIN transceiver
  • TPS7B7702-Q1 automotive dual-channel LDO
  • Common DB9 connector for supply voltage, CAN FD, and LIN bus signals
  • Follows the BoosterPack pinout standard
EVALUATION BOARD Download
document-generic User guide
49
Description
This EVM helps designers evaluate device performance, support fast development and analyze automotive local interconnect network (LIN) systems using TLIN2029 LIN physical layer transceiver devices.
Features
  • Easy access to all pins of the LIN transceiver
  • Master node pullup resistance can be enabled by a series jumper
  • Pads provided for common protection and filtering components

Design tools & simulation

SIMULATION MODEL Download
SLLM401.ZIP (32 KB) - IBIS Model
SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)
SIMULATION TOOL Download
SPICE-based analog simulation program
TINA-TI TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
document-generic User guide

CAD/CAE symbols

Package Pins Download
SOIC (D) 8 View options
SON (DRB) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos