The TMUX1109 is a precision complementary metal-oxide semiconductor (CMOS) multiplexer (MUX). The TMUX1109 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD. All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX1109 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8nA and small package options enable use in portable applications.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TMUX1109 5 V, ±2.5 V, Low-Leakage-Current, 4:1, 2-Channel Precision Multiplexer datasheet | PDF | HTML | 12 Dec 2018 |
| More literature | How to Multiplex Multiple Loads to Scale Voltage and Current Measurement Ranges | PDF | HTML | 15 Sep 2022 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 Jun 2022 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 May 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 Dec 2021 | |
| Application note | Choosing the Right Multiplexer for MCU Expansion | PDF | HTML | 19 Nov 2020 | |
| Circuit design | True differential, 4 × 2 MUX, analog front end, simultaneous-sampling ADC circui (Rev. A) | 15 Nov 2018 |
For additional terms or required resources, click any title below to view the detail page where available.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | Download |
|---|---|---|
| TSSOP (PW) | 16 | View options |
| UQFN (RSV) | 16 | View options |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.