3-pA, 5-V, ±2.5-V, 4:1, 2-channel precision multiplexer
Product details
Parameters
Package | Pins | Size
Features
- Single Supply Range: 1.08 V to 5.5 V
- Dual Supply Range: ±2.75 V
- Low Leakage Current: 3 pA
- Low Charge Injection: 1 pC
- Low On-Resistance: 1.8 Ω
- -40°C to +125°C Operating Temperature
- 1.8 V Logic Compatible
- Fail-Safe Logic
- Rail to Rail Operation
- Bidirectional Signal Path
- Break-Before-Make Switching
- ESD Protection HBM: 2000 V
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Description
The TMUX1109 is a precision complementary metal-oxide semiconductor (CMOS) multiplexer (MUX). The TMUX1109 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD. All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX1109 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8nA and small package options enable use in portable applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX1109 5 V, ±2.5 V, Low-Leakage-Current, 4:1, 2-Channel Precision Multiplexer datasheet | Dec. 12, 2018 |
Application note | Choosing the Right Multiplexer for MCU Expansion | Nov. 19, 2020 | |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | True differential, 4 × 2 MUX, analog front end, simultaneous-sampling ADC circui (Rev. A) | Nov. 15, 2018 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
UQFN (RSV) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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