3-pA, 5-V, 1:1 (SPST), 4-channel precision switch (4 active low)
Product details
Parameters
Package | Pins | Size
Features
- Wide supply range: 1.08 V to 5.5 V
- Low leakage current: 3 pA
- Low charge injection: -1.5 pC
- Low on-resistance: 2 Ω
- -40°C to +125°C operating temperature
- 1.8 V Logic compatible
- Fail-safe logic
- Rail to rail operation
- Bidirectional signal path
- Break-before-make switching
- ESD protection HBM: 2000 V
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Description
The TMUX1111, TMUX1112, and TMUX1113 are precision complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable 1:1, single-pole, single-throw (SPST) switches. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from GND to VDD.
The switches of the TMUX1111 are turned on with Logic 0 on the appropriate logic control inputs, while Logic 1 is required to turn on switches in the TMUX1112. The four channels of the TMUX1113 are split with two switches supporting Logic 0, while the other two switches support Logic 1. The TMUX1113 exhibits break-before-make switching, allowing the device to be used in cross-point switching applications.
The TMUX111x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8 nA and small package options enable use in portable applications.
Same functionality and pinout but is not an equivalent to the compared device:
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX111x 5-V, Low-Leakage-Current, 1:1 (SPST), 4-Channel Precision Switches datasheet (Rev. B) | Jul. 23, 2019 |
Application note | Dynamically Controlling Signal in a CWD Receive Path for Ultrasound | Jan. 18, 2021 | |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Technical articles | Your solution for measuring blood glucose levels just got smaller and more accurate | Feb. 12, 2019 | |
Application note | Improve Stability Issues with Low Con Multiplexers (Rev. A) | Dec. 10, 2018 | |
Application note | 1.8 V Logic for Muxes and Signal | May 16, 2018 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
UQFN (RSV) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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