Product details

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 2 CON (typ) (pF) 19 ON-state leakage current (max) (µA) 0.002 Supply current (typ) (µA) 0.009 Bandwidth (MHz) 400 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 2 CON (typ) (pF) 19 ON-state leakage current (max) (µA) 0.002 Supply current (typ) (µA) 0.009 Bandwidth (MHz) 400 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
TSSOP (PW) 16 32 mm² 5 x 6.4 UQFN (RSV) 16 4.68 mm² 2.6 x 1.8
  • Wide supply range: 1.08V to 5.5V
  • Low leakage current: 3pA
  • Low charge injection: -1.5pC
  • Low on-resistance: 2Ω
  • -40°C to +125°C operating temperature
  • 1.8V Logic compatible
  • Fail-safe logic
  • Rail to rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • ESD protection HBM: 2000V
  • Wide supply range: 1.08V to 5.5V
  • Low leakage current: 3pA
  • Low charge injection: -1.5pC
  • Low on-resistance: 2Ω
  • -40°C to +125°C operating temperature
  • 1.8V Logic compatible
  • Fail-safe logic
  • Rail to rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • ESD protection HBM: 2000V

The TMUX1111, TMUX1112, and TMUX1113 are precision complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable 1:1, single-pole, single-throw (SPST) switches. Wide operating supply of 1.08V to 5.5V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from GND to VDD.

The switches of the TMUX1111 are turned on with Logic 0 on the appropriate logic control inputs, while Logic 1 is required to turn on switches in the TMUX1112. The four channels of the TMUX1113 are split with two switches supporting Logic 0, while the other two switches support Logic 1. The TMUX1113 exhibits break-before-make switching, allowing the device to be used in cross-point switching applications.

The TMUX111x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8 nA and small package options enable use in portable applications.

The TMUX1111, TMUX1112, and TMUX1113 are precision complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable 1:1, single-pole, single-throw (SPST) switches. Wide operating supply of 1.08V to 5.5V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from GND to VDD.

The switches of the TMUX1111 are turned on with Logic 0 on the appropriate logic control inputs, while Logic 1 is required to turn on switches in the TMUX1112. The four channels of the TMUX1113 are split with two switches supporting Logic 0, while the other two switches support Logic 1. The TMUX1113 exhibits break-before-make switching, allowing the device to be used in cross-point switching applications.

The TMUX111x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8 nA and small package options enable use in portable applications.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
TMUX6211 ACTIVE 36-V Low Ron, 1:1, 4 channel, multiplexer with 1.8V logic control Pin-to-pin upgrade for improved performance, low RON and higher supply voltage support
TMUX7211 ACTIVE 44-V, low RON, 1:1 (SPST), four-channel precision multiplexer with 1.8-V logic (logic low) Pin-to-pin upgrade for improved performance, low RON and higher supply voltage support

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 8
Type Title Date
* Data sheet TMUX111x 5V, Low-Leakage-Current, 1:1 (SPST), 4-Channel Precision Switches datasheet (Rev. C) PDF | HTML 03 Aug 2023
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 26 Jul 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Guarding in Multiplexer Applications PDF | HTML 13 May 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application brief Dynamically Controlling Signal in a CWD Receive Path for Ultrasound PDF | HTML 18 Jan 2021
Technical article Your solution for measuring blood glucose levels just got smaller and more accurat PDF | HTML 12 Feb 2019
Application brief Improve Stability Issues with Low Con Multiplexers (Rev. A) 10 Dec 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

TMUX1111 IBIS Model (Rev. A)

SCDM219A.ZIP (34 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 16 Ultra Librarian
UQFN (RSV) 16 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos