44-V, latch-up immune, 8:1 precision multiplexer with 1.8-V logic
Product details
Parameters
Package | Pins | Size
Features
- Latch-Up Immune
- Dual Supply Range: ±4.5 V to ±22 V
- Single Supply Range: 4.5 V to 44 V
- Low On-Resistance: 4 Ω
- Low Charge Injection: 3 pC
- High current support: 300 mA (max)
- –40°C to +125°C Operating Temperature
- 1.8 V Logic Compatible Inputs
- Fail-Safe Logic
- Rail-to-Rail Operation
- Bidirectional Signal Path
- Break-Before-Make Switching
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Description
The TMUX7208 is a precision 8:1, single channel multiplexer featuring low on resistance and charge injection. The TMUX7208 takes one of the eight inputs and connects it to the common output determined by the state of the enable and address pins. The device works with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7208 supports bidirectional analog and digital signals onthe source (Sx) and drain (D) pins ranging from VSS to VDD.
The TMUX7208 is part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX7208 44-V, Latch-Up Immune, 8:1 Precision Multiplexer with 1.8-V Logic datasheet | Dec. 16, 2020 |
User guide | TMUX7208 Evaluation Module (Rev. A) | Dec. 23, 2020 | |
More literature | TMUX7208EVM EU RoHS Declaration of Conformity (DoC) | Dec. 18, 2020 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
WQFN (RUM) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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