The TMUX7208 is a precision 8:1, single channel multiplexer while the TMUX7209 is a 4:1, 2 channel multiplexer featuring low on resistance and charge injection. The devices work with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX720x support bidirectional analog and digital signals onthe source (Sx) and drain (D) pins ranging from VSS to VDD.
The TMUX720x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | TMUX720x 44-V, Latch-Up Immune, 8:1, 1-Channel and 4:1, 2-Channel Precision Multiplexers with 1.8-V Logic datasheet (Rev. D) | 13 Sep 2021 |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 Sep 2021 | |
| Application note | Precision Multiplexers Reducing Barriers in an Industrial Environment | 21 May 2021 | |
| User guide | TMUX7208 Evaluation Module (Rev. A) | 23 Dec 2020 | |
| Certificate | TMUX7208EVM EU RoHS Declaration of Conformity (DoC) | 18 Dec 2020 |
For additional terms or required resources, click any title below to view the detail page where available.
The TMUX7208EVM supports evaluation of the TMUX7208 devices in the 16-pin TSSOP (PW) package. This evaluation module can be used for quick prototyping and testing of the TMUX7208 devices specifically for DC and timing parameters.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | Download |
|---|---|---|
| TSSOP (PW) | 16 | View options |
| WQFN (RUM) | 16 | View options |
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