The TMUX7234 is a complementary metal-oxide semiconductor (CMOS) multiplexer with latch-up immunity. The TMUX7234 contains four independently controlled SPDT switches with an EN pin to enable or disable all four channels. The device supports single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7234 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.
All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TMUX7234 44 V, Low Ron, 2:1, 4 Channel Precision Switcheswith Latch-Up Immunity and 1.8 V Logic datasheet (Rev. F) | PDF | HTML | 15 Dec 2022 |
| Application note | How to Handle High Voltage Common Mode Applications using Multiplexers | PDF | HTML | 03 Oct 2022 | |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 Sep 2021 | ||
| Application brief | Precision Multiplexers Reducing Barriers in an Industrial Environment | PDF | HTML | 21 May 2021 |
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The TMUXRTJ-RRQEVM allows for the quick prototyping and DC characterization of TI's line of TMUX products that use 20-pin RTJ or RRQ packages (QFN) and is rated for high voltage operation.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | Download |
|---|---|---|
| TSSOP (PW) | 20 | View options |
| WQFN (RRQ) | 20 | View options |
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