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TMUX7234

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44-V, latch-up immune, 2:1, four-channel precision multiplexer with 1.8-V logic

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 4 Power supply voltage - single (V) 12, 16, 20, 36, 44, 5 Ron (Typ) (Ohms) 3.5 ON-state leakage current (Max) (µA) 0.008 Bandwidth (MHz) 100 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Integrated pulldown resistor on logic pin Input/output continuous current (Max) (mA) 400 Rating Catalog CON (Typ) (pF) 76 Supply current (Typ) (uA) 45 open-in-new Find other Analog switches & muxes

Package | Pins | Size

WQFN (RRQ) 20 16 mm² 4 x 4 open-in-new Find other Analog switches & muxes

Features

  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 3 Ω
  • Low charge injection: 3 pC
  • High current support: 400 mA (maximum)
  • –40°C to +125°C operating temperature
  • 1.8 V logic compatible inputs
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching
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Description

The TMUX7234 is a complementary metal-oxide semiconductor (CMOS) multiplexer with latch-up immunity. The TMUX7234 contains four independently controlled SPDT switches with an EN pin to enable or disable all four channels. The device supports single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7234 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.

All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

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Technical documentation

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Type Title Date
* Data sheet TMUX7234 44 V, Low Ron, 2:1, 4 Channel Precision Switcheswith Latch-Up Immunity and 1.8 V Logic datasheet (Rev. E) Aug. 06, 2021
Application note Precision Multiplexers Reducing Barriers in an Industrial Environment May 21, 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
125
Description

The TMUXRTJ-RRQEVM allows for the quick prototyping and DC characterization of TI's line of TMUX products that use 20-pin RTJ or RRQ packages (QFN) and is rated for high voltage operation.

Features
  • Quick prototyping and testing setup for TMUX devices in the RTJ or RRQ package
  • Selectable connections to VSS, GND, or float for thermal pad.
  • Selectable connections to VDD, VSS, or GND for each signal input using 2.54 mm shunt
  • Footprints for pull-up/pull-down and series resistors for each signal input
  • (...)
INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM264.ZIP (52 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
WQFN (RRQ) 20 View options

Ordering & quality

Information included:
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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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