Product details

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 12, 16, 20, 36, 44 Protocols Analog Ron (Typ) (Ohms) 9.5 CON (Typ) (pF) 20 ON-state leakage current (Max) (µA) 0.025 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection Input/output continuous current (Max) (mA) 10 Rating Catalog Supply current (Typ) (uA) 300
Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 12, 16, 20, 36, 44 Protocols Analog Ron (Typ) (Ohms) 9.5 CON (Typ) (pF) 20 ON-state leakage current (Max) (µA) 0.025 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection Input/output continuous current (Max) (mA) 10 Rating Catalog Supply current (Typ) (uA) 300
WQFN (RRP) 16 16 mm² 4 x 4
  • Wide supply voltage range:
    • Single supply: 8 V to 44 V
    • Dual supply: ±5 V to ±22 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Interrupt flags to indicate fault status
    • Output open circuited during fault
  • Latch-up immunity by device construction
  • 6 kV human body model (HBM) ESD rating
  • Low On-Resistance: 8.3 Ω typical
  • Flat On-Resistance: 10 mΩ typical
  • 1.8-V Logic capable
  • Failsafe logic: up to 44 V independent of supply

  • Industry-standard TSSOP and smaller WQFN packages
  • Wide supply voltage range:
    • Single supply: 8 V to 44 V
    • Dual supply: ±5 V to ±22 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Interrupt flags to indicate fault status
    • Output open circuited during fault
  • Latch-up immunity by device construction
  • 6 kV human body model (HBM) ESD rating
  • Low On-Resistance: 8.3 Ω typical
  • Flat On-Resistance: 10 mΩ typical
  • 1.8-V Logic capable
  • Failsafe logic: up to 44 V independent of supply

  • Industry-standard TSSOP and smaller WQFN packages

The TMUX7411F, TMUX7412F, and TMUX7413F are complementary metal-oxide semiconductor (CMOS) analog switches in 1:1 (SPST), 4-channel configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5  V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX741xF devices suitable for applications where power supply sequencing cannot be precisely controlled.

The devices block fault voltages up to +60 V or −60 V relative to ground in powered and powered-off conditions. When no power supplies are present the switch channels remain in the OFF state regardless of switch input conditions, and any control signal present on the logic pins is ignored. If the signal path input voltage on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. The drain pin (Dx) of a selected channel under a fault condition is floating. The TMUX741xF devices provide an active-low interrupt flag (FF) to indicate if any of the source inputs are experiencing a fault condition to help system diagnostics.

The TMUX7411F, TMUX7412F, and TMUX7413F are complementary metal-oxide semiconductor (CMOS) analog switches in 1:1 (SPST), 4-channel configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5  V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX741xF devices suitable for applications where power supply sequencing cannot be precisely controlled.

The devices block fault voltages up to +60 V or −60 V relative to ground in powered and powered-off conditions. When no power supplies are present the switch channels remain in the OFF state regardless of switch input conditions, and any control signal present on the logic pins is ignored. If the signal path input voltage on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. The drain pin (Dx) of a selected channel under a fault condition is floating. The TMUX741xF devices provide an active-low interrupt flag (FF) to indicate if any of the source inputs are experiencing a fault condition to help system diagnostics.

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Technical documentation

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Type Title Date
* Data sheet TMUX741xF ±60 V Fault-Protected, 1:1 (SPST), 4-Channel Switches with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. A) PDF | HTML 05 Nov 2021
Application note Replace Discrete Protection and Optimize Your PLC System Protection PDF | HTML 03 Jan 2022
Application note Protection Against Overvoltage Events, Miswiring, and Common Mode Voltages PDF | HTML 07 Oct 2021
Application note Improving Analog Input Modules Reliability Using Fault Protected Multiplexers PDF | HTML 28 Sep 2021

Design & development

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Evaluation board

TMUX741-746EVM — TMUX741xF and TMUX7462F evaluation module for the PW and RRP packages

The TMUX741-746EVM supports evaluation of the TMUX741xF and TMUX746xF device families in both TSSOP (PW) and WQFN (RRP) packages. This evaluation module (EVM) can be used for quick prototyping and testing of the TMUX741xF and TMUX746xF device families for DC parameter evaluation.

Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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Simulation model

TMUX7412F IBIS Model

SCDM271.ZIP (31 KB) - IBIS Model
Package Pins Download
WQFN (RRP) 16 View options

Ordering & quality

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