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TMUX7412F

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±60-V fault-protected, 1:1 (SPST), four-channel switches with 1.8-V logic (four active high)

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Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 12, 16, 20, 36, 44 Ron (Typ) (Ohms) 9.5 ON-state leakage current (Max) (µA) 0.025 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection Input/output continuous current (Max) (mA) 10 Rating Catalog CON (Typ) (pF) 20 Supply current (Typ) (uA) 300 open-in-new Find other Analog switches & muxes

Features

  • Wide Supply Range: ±5 V to ±22 V (Dual), 8 V to 44 V (Single)
  • Integrated Fault Protection:
    • Overvoltage Protection, Source to Supplies or to Drain: ±85 V
    • Overvoltage Protection: ±60 V
    • Powered-Off Protection: ±60 V
    • Interrupt Flags to Indicate Fault Status
    • Output Clamped to the Supply in Fault
  • Latch-Up Immunity by Device Construction
  • Low and Flat On-Resistance (8 Ω Typical)
  • Logic Levels: 1.8 V to VDD
  • Industry-Standard TSSOP and Smaller WQFN Packages
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Description

The TMUX7411F, TMUX7412F, and TMUX7413F are modern complementary metal-oxide semiconductor (CMOS) analog switches in 1:1 (SPST), 4-channel configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). All digital inputs support logic levels from 1.8 V to VDD, ensuring TTL and CMOS logic compatibility.

The switch channels remain in the OFF state regardless of switch input conditions, and any control signal present on the digital logic pins is ignored when no power supplies are present. If the analog input signal level on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance under normal operation conditions. The drain pin (Dx) is pulled to supply voltage that was exceeded when the fault channel is turned-on. The devices provide an active-low interrupt flag (FF) to indicate if any of the source inputs are experiencing a fault condition to help system diagnosis. The device blocks fault voltage up to +60 V or –60 V relative to ground in powered and powered-off conditions.

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NEW TMUX7462F PREVIEW ±60-V fault-protected, latch-up immune, 4-channel protector, adjustable fault threshold, 1.8-V logic Pin compatible option with channel protector function with drain response

Technical documentation

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* Data sheet TMUX741xF ±60 V Fault-protected, 1:1 (SPST), 4-Channel Switches with 1.8-V Logic datasheet Mar. 02, 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
125
Description

The TMUX741-746EVM supports evaluation of the TMUX741xF and TMUX746xF device families in both TSSOP (PW) and WQFN (RRP) packages. This evaluation module (EVM) can be used for quick prototyping and testing of the TMUX741xF and TMUX746xF device families for DC parameter evaluation.

Features
  • Quick prototyping and testing setup for the TMUX741xF and TMUX746xF device families in TSSOP (PW) and WQFN (RRP) packages
  • Supply decoupling capacitors installed for VDD, VSS, VFP, and VFN pins with two extra pads for additional decoupling capacitors if needed
  • Protection diode pads available for all (...)
INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

CAD/CAE symbols

Package Pins Download
(RRP) 16 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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