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TPS650372-Q1

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3 step-down converters with 1 LDO PMIC in a small 3 x 2.5mm QFN

Product details

TI functional safety category Functional Safety-Compliant Rating Automotive Operating temperature range (°C) to
TI functional safety category Functional Safety-Compliant Rating Automotive Operating temperature range (°C) to
WQFN-HR (VAT) 18 7.5 mm² 3 x 2.5
  • Qualified for automotive applications
  • AEC-Q100 qualified with following results:
    • Device operates from 4V to 18V input supply
    • Input supply 36V tolerant
    • Device temperature grade 1: -40°C to +125°C
  • Functional Safety -Compliant targeted
    • Developed for functional safety applications
    • Documentation to aid ISO26262 and IEC61508 system design available upon product release
    • Systematic capability and hardware integrity up to ASIL-B targeted
    • Under/overvoltage monitors with Built-In Self-Test
    • Temperature warning and thermal shutdown
  • Mid-VIN step-down converter BUCK1
    • VIN range from 4V to 18V
    • VOUT range from 3V to 5V
    • Output current up to 1.5A for normal operation
    • Output current up to 2.5A for heater mode (limited temperature and VSYS)
    • 2.2MHz switching frequency
  • Two Low-VIN step-down converters BUCK2, BUCK3:
    • VIN range from 2.5V to 5.5V
    • VOUT range from 0.8V to 1.8V
    • Output current 2A for BUCK2, 1A for BUCK3
    • 2.2MHz or 4.4MHz switching frequency
  • One low dropout (LDO) regulator:
    • VIN range from 2.5V to 5.5V
    • VOUT range from 1.2V to 3.3V
    • Up to 300mA output current
    • Low noise and high PSRR
  • 3mm × 2.5mm 18-pin WQFN-HR with wettable flanks
  • Qualified for automotive applications
  • AEC-Q100 qualified with following results:
    • Device operates from 4V to 18V input supply
    • Input supply 36V tolerant
    • Device temperature grade 1: -40°C to +125°C
  • Functional Safety -Compliant targeted
    • Developed for functional safety applications
    • Documentation to aid ISO26262 and IEC61508 system design available upon product release
    • Systematic capability and hardware integrity up to ASIL-B targeted
    • Under/overvoltage monitors with Built-In Self-Test
    • Temperature warning and thermal shutdown
  • Mid-VIN step-down converter BUCK1
    • VIN range from 4V to 18V
    • VOUT range from 3V to 5V
    • Output current up to 1.5A for normal operation
    • Output current up to 2.5A for heater mode (limited temperature and VSYS)
    • 2.2MHz switching frequency
  • Two Low-VIN step-down converters BUCK2, BUCK3:
    • VIN range from 2.5V to 5.5V
    • VOUT range from 0.8V to 1.8V
    • Output current 2A for BUCK2, 1A for BUCK3
    • 2.2MHz or 4.4MHz switching frequency
  • One low dropout (LDO) regulator:
    • VIN range from 2.5V to 5.5V
    • VOUT range from 1.2V to 3.3V
    • Up to 300mA output current
    • Low noise and high PSRR
  • 3mm × 2.5mm 18-pin WQFN-HR with wettable flanks

The TPS65037x-Q1 device is a highly integrated power management IC for automotive camera modules. This device combines three step-down converters and one low-dropout (LDO) regulator. The BUCK1 step-down converter operating input voltage range is up to 18V. The device can tolerate input voltage up to 36V (not recommended for a prolonged time period). All converters operate in a forced fixed-frequency PWM mode and support optional Spread-Spectrum Modulation (SSM) for EMI reduction. The LDO can supply 300mA and operate with an input voltage range from 2.5V to 5.5V. The TPS65037x-Q1 supports I2C control interface with interrupt pin or, alternatively, three GPIOs.

The TPS65037x-Q1 is available in a 18-pin WQFN-HR package (3mm × 2.5mm).

The TPS65037x-Q1 device is a highly integrated power management IC for automotive camera modules. This device combines three step-down converters and one low-dropout (LDO) regulator. The BUCK1 step-down converter operating input voltage range is up to 18V. The device can tolerate input voltage up to 36V (not recommended for a prolonged time period). All converters operate in a forced fixed-frequency PWM mode and support optional Spread-Spectrum Modulation (SSM) for EMI reduction. The LDO can supply 300mA and operate with an input voltage range from 2.5V to 5.5V. The TPS65037x-Q1 supports I2C control interface with interrupt pin or, alternatively, three GPIOs.

The TPS65037x-Q1 is available in a 18-pin WQFN-HR package (3mm × 2.5mm).

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Technical documentation

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* Data sheet TPS65037x-Q1 Automotive Camera PMIC datasheet PDF | HTML 07 Jan 2026

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPS65037EVM — TPS65037x-Q1 evaluation module

The TPS65037EVM is an evaluation board for the TPS65037x-Q1 power management IC (PMIC) devices. The EVM includes an onboard USB-to-I2C adapter, power terminals, and jumpers for all DC regulator inputs and outputs, and test points for common measurements.
Not available on TI.com
GUI for evaluation module (EVM)

TPS65037X-GUI TPS65037X Graphical User Interface (GUI)

Graphical user interface used to communicate with the TPS65037X PMIC through I2C and evaluate device functionality and performance.
Supported products & hardware

Supported products & hardware

Products
Multi-channel ICs (PMICs)
  • TPS650372-Q1 3 step-down converters with 1 LDO PMIC in a small 3 x 2.5mm QFN
Hardware development
Evaluation board
Certification

TPS65037EVM-DOC-CERT TPS65037EVM EU Declaration of Conformity (DoC)

TPS65037EVM EU Declaration of Conformity (DoC)
Supported products & hardware

Supported products & hardware

Products
Multi-channel ICs (PMICs)
  • TPS650372-Q1 3 step-down converters with 1 LDO PMIC in a small 3 x 2.5mm QFN
Hardware development
Evaluation board
Design tool

TPS65037X-Q1-DESIGN TPS65037x-Q1 Design Resources

TPS65037x-Q1 Design Resources
Supported products & hardware

Supported products & hardware

Products
Multi-channel ICs (PMICs)
  • TPS650372-Q1 3 step-down converters with 1 LDO PMIC in a small 3 x 2.5mm QFN
Package Pins CAD symbols, footprints & 3D models
WQFN-HR (VAT) 18 Ultra Librarian

Ordering & quality

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  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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