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EVALUATION BOARD Download
INTERFACE ADAPTER Download
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
REFERENCE DESIGNS Download
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
DAC Sample and Hold Glitch Reduction Reference Design
TIPD142 — DAC R-2R architectures display great performance in regards to noise and accuracy, but at a cost of large glitch area. This design focuses on the reduction of major-carry glitches that occur from code specific transitions in DAC R-2R architectures. This design reduces this glitch area, making it (...)