Product details

Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 1.8, 2.5, 3.3 Protocols Analog, I2C, UART Ron (typ) (Ω) 0.45 CON (typ) (pF) 140 ON-state leakage current (max) (µA) 0.4 Supply current (typ) (µA) 0.01 Bandwidth (MHz) 50 Operating temperature range (°C) -40 to 85 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (mA) 300 Rating Catalog
Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 1.8, 2.5, 3.3 Protocols Analog, I2C, UART Ron (typ) (Ω) 0.45 CON (typ) (pF) 140 ON-state leakage current (max) (µA) 0.4 Supply current (typ) (µA) 0.01 Bandwidth (MHz) 50 Operating temperature range (°C) -40 to 85 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (mA) 300 Rating Catalog
UQFN (RSE) 10 3 mm² 2 x 1.5 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Specified Break-Before-Make Switching
  • Low ON-State Resistance (0.65-Ω Maximum)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion
  • 1.65-V to 3.6-V Single-Supply Operation
  • Bidirectional Signal Paths
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Specified Break-Before-Make Switching
  • Low ON-State Resistance (0.65-Ω Maximum)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion
  • 1.65-V to 3.6-V Single-Supply Operation
  • Bidirectional Signal Paths
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

The TS3A24157 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 3.6 V. The device offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transfer of a signal from one channel to another. The device has excellent total harmonic distortion (THD) performance and consumes very-low power. These features make this device suitable for portable audio applications.

The TS3A24157 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 3.6 V. The device offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transfer of a signal from one channel to another. The device has excellent total harmonic distortion (THD) performance and consumes very-low power. These features make this device suitable for portable audio applications.

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Technical documentation

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Type Title Date
* Data sheet TS3A24157 0.65-Ω 2-Channel SPDT Analog Switch 2-Channel 2:1 Multiplexer and Demultiplexer datasheet (Rev. B) PDF | HTML 12 Oct 2016
More literature 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 26 Jul 2022
More literature Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
More literature Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
More literature Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
More literature Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

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Evaluation board

DIP-ADAPTER-EVM — DIP adapter evaluation module

Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)

User guide: PDF
Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
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Simulation model

HSPICE Model for TS3A24157

SCDM112.ZIP (101 KB) - HSpice Model
Simulation model

TS3A24157 IBIS Model

SCDM111.ZIP (68 KB) - IBIS Model
Package Pins Download
UQFN (RSE) 10 View options
VSSOP (DGS) 10 View options

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