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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 2 Power supply voltage - single (V) 1.8, 2.5, 3.3 Ron (Typ) (Ohms) 0.45 ON-state leakage current (Max) (µA) 0.4 Bandwidth (MHz) 50 Operating temperature range (C) -40 to 85 Features Break-before-make, Supports I2C signals, 1.8-V compatible control inputs Input/output continuous current (Max) (mA) 300 Rating Catalog CON (Typ) (pF) 140 Supply current (Typ) (uA) 0.01 open-in-new Find other Analog switches & muxes

Package | Pins | Size

UQFN (RSE) 10 3 mm² 2 x 1.5 VSSOP (DGS) 10 9 mm² 3 x 3 open-in-new Find other Analog switches & muxes

Features

  • Specified Break-Before-Make Switching
  • Low ON-State Resistance (0.65-Ω Maximum)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion
  • 1.65-V to 3.6-V Single-Supply Operation
  • Bidirectional Signal Paths
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
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Description

The TS3A24157 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 3.6 V. The device offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transfer of a signal from one channel to another. The device has excellent total harmonic distortion (THD) performance and consumes very-low power. These features make this device suitable for portable audio applications.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 6
Type Title Date
* Datasheet TS3A24157 0.65-Ω 2-Channel SPDT Analog Switch 2-Channel 2:1 Multiplexer and Demultiplexer datasheet (Rev. B) Oct. 12, 2016
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note 1.8 V Logic for Muxes and Signal May 16, 2018
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM111.ZIP (68 KB) - IBIS Model
SIMULATION MODEL Download
SCDM112.ZIP (101 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
UQFN (RSE) 10 View options
VSSOP (DGS) 10 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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Support & training

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