TS3A5017

ACTIVE

3.3-V, 4:1, 2-channel general-purpose analog multiplexer

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Product details

Parameters

Configuration 4:1 Number of channels (#) 2 Power supply voltage - single (V) 2.5, 3.3 Ron (Typ) (Ohms) 11 ON-state leakage current (Max) (µA) 0.2 Bandwidth (MHz) 165 Operating temperature range (C) -40 to 85 Features Powered-off protection, Supports I2C signals Input/output continuous current (Max) (mA) 128 Rating Catalog CON (Typ) (pF) 24 Supply current (Typ) (uA) 2.5 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 UQFN (RSV) 16 5 mm² 2.6 x 1.8 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Analog switches & muxes

Features

  • Isolation in the Powered-Down Mode, V+ = 0
  • Low ON-State Resistance
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 2.3-V to 3.6-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 1500-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

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Description

The TS3A5017 device is a dual single-pole quadruple-throw (4:1) analog switch that is designed to operate from 2.3 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction.

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Technical documentation

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Type Title Date
* Datasheet TS3A5017 Dual SP4T Analog Switch / Multiplexer / Demultiplexer datasheet (Rev. G) Jan. 07, 2019
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Reference designs

REFERENCE DESIGNS Download
Inductive Touch Stainless Steel Keypad Reference Design for Waterproof/Noise Immune HMI Applications
TIDA-01102 — This 16-button stainless steel keypad, which utilizes TI's inductive touch technology, demonstrates highly sensitive buttons on a single piece of 0.6mm thick stainless steel metal.  The design utilizes a MUXed approach to implement many buttons with a single LDC1614. The design is (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
IEPE Vibration Sensor Interface for PLC Analog Input Reference Design
TIDA-01471 — Industrial vibration sensing is crucial part in condition monitoring necessary for predictive maintenance. Integrated Electronic Piezoelectric (IEPE) sensor is the most common vibration sensor used in industrial environment. This design is a full analog front-end for IEPE sensor interface (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Analog Front End (AFE) for Sensing Temperature in Smart Grid Applications Using RTD Reference Design
TIDA-00110 This reference design enables up to 4 Resistor Temperature Detectors (RTD) to be connected through one ADC in manner such that the solution is both compact and modular. Communication from the ADC to the processor is though an SPI interface. If 8 RTDs are required for an application, simply connect (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
TVSOP (DGV) 16 View options
UQFN (RSV) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

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