0.75-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with 1.8-V input logic
Product details
Parameters
Package | Pins | Size
Features
- 2-Channel Single-Pole Single-Throw (SPST) Switch
- 1.65-V to 5.5-V Power Supply (VCC)
- Isolation in Power-Down Mode, VCC = 0
- Low ON-State Resistance (0.75 Ω Typical)
- Excellent ON-State Resistance Matching
- Low Charge Injection
- Low Total Harmonic Distortion (THD+N)
- High Bandwidth (260 MHz)
- 1.8-V Compatible Control Input
Threshold Independent of VCC - Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
Description
The TS5A21366 is a bidirectional, 2-channel, single-pole single-throw (SPST) analog switch that is designed to operate from 1.65-V to 5.5-V supply voltages. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance matching. The device has excellent total harmonic distortion (THD+N) performance and consumes very low power.
The control pin can be connected to a low voltage GPIO allowing it to be controlled by 1.8-V signals.
These features make this device ideal for portable audio applications.
The TS5A21366 is available in a small, space-saving 8-pin DCU or RSE package, and is characterized for operation over the free-air temperature range of –40°C to 85°C.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Programmer board compatible with CapTIvate MCU boards
- EnergyTrace Technology to measure power consumption with Code Composer Studio
- CapTIvate programming header for interfacing with CapTIvate MCU boards
- USB HID-Bridge communications interface allows easy debug data transfer between the target and a PC (...)
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
Features
- USB powered and provision for external power
- Connector available to interface with different transducer types
- BoosterPack headers available to interface with external boards (I2C, SPI, UART, GPIO) and RF communication modules
- On-board segmented LCD
- On-board eZ-FET emulation circuit to enable programming (...)
Description
Step 1 : Buy the EVM
Step 2 : Refer to the quick start guide
Step 3 : Download the Water Metering Software
Step 4 : Refer the TI Design TIDM-1019
The EVM430-FR6047 evaluation kit is a development platform to evaluate the performance of the MSP430FR6047 MCUs for ultrasonic sensing applications (e.g (...)
Features
- USB powered and provision for external power
- Connector available to interface with different transducer types
- BoosterPack™ plug-in module headers available to interface with external boards (I2C, SPI, UART, GPIO) and RF communication modules
- On-board segmented LCD
- On-board eZ-FET emulation circuit to (...)
Description
To get started developing:
Step 1: Watch the LaunchPad demo video
Step 2: Download the LaunchPad User's Guide
Step 3: Download the Out-of-Box Demo GUI and run demo
Features
- ULP FRAM technology based on the MSP430FR2355 16-bit MCU with smart analog combo
- On-board eZ-FET debug probe with EnergyTrace Technology available for ultra-low-power debugging
- 40-pin LaunchPad headers to leverage the BoosterPack ecosystem
- 2 buttons and 2 LEDs for user interaction
- On-board ambient light (...)
Description
To get started developing:
Step 1: Buy Launchpad
Step 2: Run the out of box experience
Step 3: Do the blink LED Lab
The MSP-EXP430FR2433 LaunchPad™ Development Kit is an easy-to-use evaluation module (EVM) based on the MSP430FR2433 Value Line Sensing microcontroller (MCU). It contains (...)
Features
- ULP FRAM technology based MSP430FR2433 16-bit MCU
- EnergyTrace™ Technology available for ultra-low-power debugging
- 20-pin LaunchPad kit standard leveraging the BoosterPack ecosystem
- On-board eZ-FET debug probe
- 2 buttons and 2 LEDs for user interaction
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Reference designs
Design files
-
download TIPD188 BOM.pdf (193KB)
Design files
-
download TIDA-00886 BOM.pdf (229KB) -
download TIDA-00886 Gerber.zip (248KB)
Design files
-
download TIDA-00765 BOM.pdf (63KB) -
download TIDA-00765 Assembly Drawing.pdf (250KB) -
download TIDA-00765 PCB.pdf (1764KB) -
download TIDA-00765 Gerber.zip (434KB) -
download TIDA-00765 Design File .zip (3319KB)
Design files
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| UQFN (RSE) | 8 | View options |
| VSSOP (DCU) | 8 | View options |
Ordering & quality
Support & training
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