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TS5A3166

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0.9-Ω on-state resistance, 5-V, 1:1 (SPST), 1-channel analog switch (active high)

Data sheet
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0.9-Ω on-state resistance, 5-V, 1:1 (SPST), 1-channel analog switch (active high)

TS5A3166

ACTIVE
Data sheet Order now

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 0.7 ON-state leakage current (Max) (µA) 0.02 Bandwidth (MHz) 200 Operating temperature range (C) -40 to 85 Features Break-before-make Input/output continuous current (Max) (mA) 200 Rating Catalog CON (Typ) (pF) 36.5 Supply current (Typ) (uA) 0.001 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 open-in-new Find other Analog switches & muxes

Features

  • Low ON-State Resistance (0.9 Ω)
  • Control Inputs Are 5.5-V Tolerant
  • Low Charge Injection
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
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Description

The TS5A3166 device is a single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.

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Technical documentation

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Type Title Date
* Data sheet TS5A3166 0.9-Ω SPST Analog Switch datasheet (Rev. E) Feb. 09, 2018
Application note Selecting the Right Texas Instruments Signal Switch (Rev. C) Aug. 06, 2021
Application note Multiplexers and Signal Switches Glossary (Rev. A) Jun. 09, 2021
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
View details
INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel
View details

Design tools & simulation

SIMULATION MODEL Download
SCDJ032.ZIP (88 KB) - HSpice Model
SIMULATION MODEL Download
SCDM083.ZIP (94 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
Wireless IoT, Bluetooth® Low Energy, 4½ Digit, 100kHz True RMS Digital Multimeter
TIDA-01012 — Many products are now becoming connected through the Internet of Things (IoT), including test equipment such as digital multimeters (DMM).  Enabled by Texas Instruments’ SimpleLink™ ultra-low power wireless microcontroller (MCU) platform, the TIDA-01012 reference design demonstrates (...)
document-generic Schematic
REFERENCE DESIGNS Download
Enhanced Accuracy Battery Fuel Gauge Reference Design for Low Power Industrial IoT Field Metering
TIDA-01014 — The Internet of Things (IoT) revolution is efficiently connecting applications and instruments, enabling battery powered, wide scale very low power sensor deployment.  New technologies, such as TI’s advanced sensor and low power connectivity devices, are enabling these instruments to be (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SOT-23 (DBV) 5 View options

Ordering & quality

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  • Ongoing reliability monitoring

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