The UCC35341-Q1 is an automotive qualified
high isolation voltage DC/DC power module designed to provide power to SiC
and IGBT isolated gate drivers. Its proprietary integrated transformer, flip-chip package, and
advanced control architectures achieve high power density, low noise, and lowest
system BOM. This device is capable of delivering 2W
typical output power at 85oC ambient temperature. The highly accurate
dual-output voltages, easily set by resistor dividers, enable low on-resistance,
fast and reliable switching for SiC/IGBT. The low-latency feedback control reduces the output capacitance
for fast load transient and supports dynamic voltage programming. The wide input
voltage and adjustable VIN UVLO supports both wide battery voltage of
electric vehicles and regulated input rails. It is operational from 8V to 20V VIN, and
can withstand VIN overvoltage transients up to 28V.
The integrated protection features, fault-report
Power-Good pin, and enable function increase system robustness and save external
components. The SOIC package with 8.2mm creepage and clearance distance ensures high
isolation capability.
The UCC35341-Q1 is an automotive qualified
high isolation voltage DC/DC power module designed to provide power to SiC
and IGBT isolated gate drivers. Its proprietary integrated transformer, flip-chip package, and
advanced control architectures achieve high power density, low noise, and lowest
system BOM. This device is capable of delivering 2W
typical output power at 85oC ambient temperature. The highly accurate
dual-output voltages, easily set by resistor dividers, enable low on-resistance,
fast and reliable switching for SiC/IGBT. The low-latency feedback control reduces the output capacitance
for fast load transient and supports dynamic voltage programming. The wide input
voltage and adjustable VIN UVLO supports both wide battery voltage of
electric vehicles and regulated input rails. It is operational from 8V to 20V VIN, and
can withstand VIN overvoltage transients up to 28V.
The integrated protection features, fault-report
Power-Good pin, and enable function increase system robustness and save external
components. The SOIC package with 8.2mm creepage and clearance distance ensures high
isolation capability.