The TPS53626 device is a driverless, VR13 SVID compliant, synchronous buck
controller. Advanced control features such as D-CAP+ architecture with
overlapping pulse support undershoot reduction (USR) and overshoot reduction
(OSR) provide fast transient response, lowest output capacitance and high
efficiency. The device also supports single-phase operation in CCM or DCM for
light-load efficiency boost. The device integrates a full set of VR13 I/O
features including VR_READY (PGOOD), ALERT and VR_HOT.
The SVID interface address allows programming from 00h to 07h. Adjustable
control of VOUT slew rate can be programmed as high as 20mV/uS.
Paired with the TI NexFET Power Stage, this total solution delivers
exceptionally high speed and low switching loss. The TPS53626 also offers four
default modes that configure VCCIO and VMCP settings with one single external
resistor to save component count and board space.
The TPS53626 device package is a space saving, thermally enhanced 32-pin VQFN
package that operates from –40°C to 105°C.
For all available
packages, see the orderable addendum at the end of the document.
The TPS53626 device is a driverless, VR13 SVID compliant, synchronous buck
controller. Advanced control features such as D-CAP+ architecture with
overlapping pulse support undershoot reduction (USR) and overshoot reduction
(OSR) provide fast transient response, lowest output capacitance and high
efficiency. The device also supports single-phase operation in CCM or DCM for
light-load efficiency boost. The device integrates a full set of VR13 I/O
features including VR_READY (PGOOD), ALERT and VR_HOT.
The SVID interface address allows programming from 00h to 07h. Adjustable
control of VOUT slew rate can be programmed as high as 20mV/uS.
Paired with the TI NexFET Power Stage, this total solution delivers
exceptionally high speed and low switching loss. The TPS53626 also offers four
default modes that configure VCCIO and VMCP settings with one single external
resistor to save component count and board space.
The TPS53626 device package is a space saving, thermally enhanced 32-pin VQFN
package that operates from –40°C to 105°C.
For all available
packages, see the orderable addendum at the end of the document.