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Microcontroladores (MCU) y procesadores
Procesadores digitales de señales (DSP)

66AK2L06

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Sistema en chip (SoC) DSP+ARM Keystone II multinúcleo

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66AK2L06

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Detalles del producto

DSP type 4 C66x DSP (max) (MHz) 1200 CPU 32-/64-bit Operating system Integrity, Linux, SYS/BIOS, VxWorks Security Cryptographic acceleration, Device identity, Secure boot Ethernet MAC 4-port 1Gb Switch PCIe 2 PCIe Gen2 Rating Catalog Operating temperature range (°C) 0 to 0
DSP type 4 C66x DSP (max) (MHz) 1200 CPU 32-/64-bit Operating system Integrity, Linux, SYS/BIOS, VxWorks Security Cryptographic acceleration, Device identity, Secure boot Ethernet MAC 4-port 1Gb Switch PCIe 2 PCIe Gen2 Rating Catalog Operating temperature range (°C) 0 to 0
FCBGA (CMS) 900 625 mm² 25 x 25
  • Four TMS320C66x DSP Core Subsystems (C66x
    CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point
      DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2
        GHz
    • Memory
      • 32K Byte L1P Per CorePac
      • 32K Byte L1D PerCorePac
      • 1024K Byte Local L2 Per CorePac
  • ARM CorePac
    • Two ARM® Cortex®-A15 MPCore™ Processors
      at Up to 1.2 GHz
    • 1MB L2 Cache Memory Shared by Two ARM
      Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC for Low
      Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory Shared by Four DSP
      CorePacs and One ARM CorePac
    • Memory Protection Unit for Both MSM SRAM
      and DDR3_EMIF
  • On-chip Standalone RAM (OSR) - 1MB On-Chip
    SRAM for Additional Shared Memory
  • Hardware Coprocessors
    • Two Fast Fourier Transform Coprocessors
      • Support Up to 1200 Msps at FFT Size 1024
      • Support Max FFT Size 8192
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • Packet-Based DMA for Zero-Overhead
      Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security AcceleratorEngine Enables Support for
      • IPSec, SRTP, and SSL/TLS Security
      • ECB, CBC, CTR, F8,CCM, GCM, HMAC,
        CMAC, GMAC, AES, DES, 3DES, SHA-1,
        SHA-2 (256-bit Hash), MD5
      • Up to 6.4 Gbps IPSec
    • Ethernet Subsystem
    • Peripherals
      • DigitalFront End (DFE) Subsystem
        • Support up to Four Lane JESD204A/B (7.37
          Gbps Line Rate Max.) Interface to Multiple
          Data Converters
        • Integration of Digital Down/Up-Conversion
          (DDC/DUC) Module
      • IQNet Subsystem
        • Transporting data streams to an integrated
          Digital Front End (DFE)
      • Two One-Lane PCIe Gen2 Interfaces
        • Supports Up to 5 GBaud
      • Three Enhanced Direct Memory Access (EDMA)
        Controllers
      • 72-Bit DDR3 Interface, Speeds Up to 1600 MHz
      • EMIF16 Interface
      • USB 3.0 Interface
      • USIM Interface
      • Four UART Interfaces
      • Three I2C Interfaces
      • 64 GPIO Pins
      • Three SPI Interfaces
      • Semaphore Module
      • Fourteen 64-Bit Timers
    • Commercial Case Temperature:
      • 0°C to 100°C
    • Extended Case Temperature:
      • –40°C to 100°C
  • Four TMS320C66x DSP Core Subsystems (C66x
    CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point
      DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2
        GHz
    • Memory
      • 32K Byte L1P Per CorePac
      • 32K Byte L1D PerCorePac
      • 1024K Byte Local L2 Per CorePac
  • ARM CorePac
    • Two ARM® Cortex®-A15 MPCore™ Processors
      at Up to 1.2 GHz
    • 1MB L2 Cache Memory Shared by Two ARM
      Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC for Low
      Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory Shared by Four DSP
      CorePacs and One ARM CorePac
    • Memory Protection Unit for Both MSM SRAM
      and DDR3_EMIF
  • On-chip Standalone RAM (OSR) - 1MB On-Chip
    SRAM for Additional Shared Memory
  • Hardware Coprocessors
    • Two Fast Fourier Transform Coprocessors
      • Support Up to 1200 Msps at FFT Size 1024
      • Support Max FFT Size 8192
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • Packet-Based DMA for Zero-Overhead
      Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security AcceleratorEngine Enables Support for
      • IPSec, SRTP, and SSL/TLS Security
      • ECB, CBC, CTR, F8,CCM, GCM, HMAC,
        CMAC, GMAC, AES, DES, 3DES, SHA-1,
        SHA-2 (256-bit Hash), MD5
      • Up to 6.4 Gbps IPSec
    • Ethernet Subsystem
    • Peripherals
      • DigitalFront End (DFE) Subsystem
        • Support up to Four Lane JESD204A/B (7.37
          Gbps Line Rate Max.) Interface to Multiple
          Data Converters
        • Integration of Digital Down/Up-Conversion
          (DDC/DUC) Module
      • IQNet Subsystem
        • Transporting data streams to an integrated
          Digital Front End (DFE)
      • Two One-Lane PCIe Gen2 Interfaces
        • Supports Up to 5 GBaud
      • Three Enhanced Direct Memory Access (EDMA)
        Controllers
      • 72-Bit DDR3 Interface, Speeds Up to 1600 MHz
      • EMIF16 Interface
      • USB 3.0 Interface
      • USIM Interface
      • Four UART Interfaces
      • Three I2C Interfaces
      • 64 GPIO Pins
      • Three SPI Interfaces
      • Semaphore Module
      • Fourteen 64-Bit Timers
    • Commercial Case Temperature:
      • 0°C to 100°C
    • Extended Case Temperature:
      • –40°C to 100°C

The 66AK2L06 KeyStone SoC is a member of the C66x family based on TI's new KeyStone II Multicore SoC Architecture and is a low-power solution with integrated JESD204B lanes that meets the more stringent power, size, and cost requirements of applications requiring connectivity with ADC and DAC based applications. The device’s ARM and DSP cores deliver exceptional processing power on platforms requiring high signal and control processing.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (ARM CorePac, C66x CorePacs, IP network, Digital Front End, and FFT processing) and uses a queue-based communication system that allows the SoC resources to operate efficiently and seamlessly. This unique SoC architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to dedicated coprocessors and high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

The addition of the ARM CorePac in the 66AK2L06 device enables the ability for complex control code processing on-chip. Operations such as housekeeping and management processing can be performed with the Cortex-A15 processor.

TI’s new C66x core launches a new era of DSP technology by combining fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x CorePac incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2L06 contains many coprocessors to offload the bulk of the processing demands of higher layers of application. This keeps the cores free for algorithms and other differentiating functions. The SoC contains multiple copies of key coprocessors such as the FFTC. The architectural elements of the SoC (Multicore Navigator) ensure that data is processed without any CPU intervention or overhead, allowing the system to make optimal use of its resources.

TI’s scalable multicore SoC architecture solutions provide developers with a range of software-compatible and hardware-compatible devices to minimize development time and maximize reuse.

The 66AK2L06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows and Linux debugger interface for visibility into source code execution.

The 66AK2L06 KeyStone SoC is a member of the C66x family based on TI's new KeyStone II Multicore SoC Architecture and is a low-power solution with integrated JESD204B lanes that meets the more stringent power, size, and cost requirements of applications requiring connectivity with ADC and DAC based applications. The device’s ARM and DSP cores deliver exceptional processing power on platforms requiring high signal and control processing.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (ARM CorePac, C66x CorePacs, IP network, Digital Front End, and FFT processing) and uses a queue-based communication system that allows the SoC resources to operate efficiently and seamlessly. This unique SoC architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to dedicated coprocessors and high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

The addition of the ARM CorePac in the 66AK2L06 device enables the ability for complex control code processing on-chip. Operations such as housekeeping and management processing can be performed with the Cortex-A15 processor.

TI’s new C66x core launches a new era of DSP technology by combining fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x CorePac incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2L06 contains many coprocessors to offload the bulk of the processing demands of higher layers of application. This keeps the cores free for algorithms and other differentiating functions. The SoC contains multiple copies of key coprocessors such as the FFTC. The architectural elements of the SoC (Multicore Navigator) ensure that data is processed without any CPU intervention or overhead, allowing the system to make optimal use of its resources.

TI’s scalable multicore SoC architecture solutions provide developers with a range of software-compatible and hardware-compatible devices to minimize development time and maximize reuse.

The 66AK2L06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows and Linux debugger interface for visibility into source code execution.
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Soporte de un proveedor externo

Para este producto, TI no cuenta con soporte de diseño directo continuo. Para obtener ayuda mientras trabaja en su diseño, puede ponerse en contacto con el siguiente tercero: Tecnología Azcom.

Documentación técnica

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Tipo Título Fecha
* Data sheet 66AK2L06 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet 21 abr 2015
* Errata 66AK2Lxx Multicore DSP+ARM KeyStone II SOC (Silicon Revision 1.0) 20 abr 2015
Application note DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 07 jul 2022
Application note Keystone Error Detection and Correction EDC ECC (Rev. A) 25 jun 2021
Application note Using Arm ROM Bootloader on Keystone II Devices PDF | HTML 04 jun 2019
User guide KeyStone II Architecture Universal Serial Bus 3.0 (USB 3.0) (Rev. A) 21 ago 2017
Application note Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 14 ago 2017
User guide Phase-Locked Loop (PLL) for KeyStone Devices User's Guide (Rev. I) 26 jul 2017
Design guide Wideband Receiver With 66AK2L06 JESD204B Attach to ADC32RF80 Reference Design 23 sep 2016
Application note Keystone EDMA FAQ 01 sep 2016
Third party document Download XEVMK2LX schematics, bill of materials and design guide 03 ago 2016
Third party document XEVMK2LX Quick Setup Guide 03 ago 2016
User guide Serializer/Deserializer (SerDes) for KeyStone II Devices User Guide (Rev. A) 27 jul 2016
Application note Power Management of KS2 Device (Rev. C) 15 jul 2016
Application note 66AK2L06 JESD Attach to ADC12J4000/DAC38J84 Getting Started Guide (Rev. B) 20 jun 2016
Technical article How to complete your RF sampling solution PDF | HTML 18 may 2016
Application note SERDES Link Commissioning on KeyStone I and II Devices 13 abr 2016
Technical article Accelerating the Fast Fourier Transform (FFT/iFFT) by 10x and more PDF | HTML 02 mar 2016
White paper Multicore SoCs stay a step ahead of SoC FPGAs 23 feb 2016
Application note TI DSP Benchmarking 13 ene 2016
Application note Throughput Performance Guide for KeyStone II Devices (Rev. B) 22 dic 2015
White paper Optimizing Modern Radar Systems using Low- Latency, High-Performance FFT Coproce 17 dic 2015
Technical article Are 66AK2L06 SoCs an answer to miniaturization of test and measurement equipment? PDF | HTML 02 dic 2015
White paper Optimizing your test and measurement solution by leveraging the most integrated 03 nov 2015
Design guide 66AK2L06 JESD Attach to ADC12J4000 / DAC38J84 Design Guide (Rev. A) 22 oct 2015
Application note Keystone II DDR3 Debug Guide 16 oct 2015
Application note System solution for avionics & defense 23 sep 2015
Application note TPS544Bxx/TPS544Cxx Powering TCI6630K2L in Smart Reflex Class 0 TC Mode 18 sep 2015
Technical article Summertime showdown: DSPs vs FPGAs PDF | HTML 09 jul 2015
User guide Enhanced Direct memory Access 3 (EDMA3) for KeyStone Devices User's Guide (Rev. B) 06 may 2015
Technical article Wireless infrastructure - Now simpler and more accessible! PDF | HTML 05 may 2015
User guide Gigabit Ethernet (GbE) Switch SS for K2E & K2L Devices User's Guide (Rev. A) 28 abr 2015
Product overview 66AK2L06 SoC Product Bulletin 15 abr 2015
User guide Multicore Navigator (CPPI) for KeyStone Architecture User's Guide (Rev. H) PDF | HTML 09 abr 2015
White paper Optimizing synthetic aperture radar design with TI's integrated 66AK2L06 SoC 09 abr 2015
User guide DDR3 Memory Controller for KeyStone II Devices User's Guide (Rev. C) 27 mar 2015
User guide Digital Front End (DFE) for Keystone II Devices User's Guide (Rev. A) 23 mar 2015
White paper Ready to make the jump to JESD204B? White Paper (Rev. B) 19 mar 2015
User guide Fast Fourier Transform Coprocessor (FFTC) for KeyStone II Devices User's Guide (Rev. A) 11 feb 2015
Application note Keystone II DDR3 Initialization 26 ene 2015
User guide IQN2 for KeyStone II Devices User's Guide (Rev. A) 01 oct 2014
User guide Power Sleep Controller (PSC) for KeyStone Devices User's Guide (Rev. C) 04 sep 2014
User guide Packet Accelerator 2 (PA2) for K2E and K2L Devices User's Guide 19 ago 2014
User guide Security Accelerator 2 (SA2) for K2E and K2L Devices User's Guide 19 ago 2014
User guide Network Coprocessor (NETCP) for K2E and K2L Devices User's Guide 13 ago 2014
Application note Hardware Design Guide for KeyStone II Devices 24 mar 2014
User guide Debug and Trace for KeyStone II Devices User's Guide 26 jul 2013
User guide DSP Bootloader for KeyStone Architecture User's Guide (Rev. C) 15 jul 2013
User guide C66x CorePac User's Guide (Rev. C) 28 jun 2013
User guide Memory Protection Unit (MPU) for KeyStone Devices User's Guide (Rev. A) 28 jun 2013
User guide Multicore Shared Memory Controller (MSMC) User Guide for KeyStone II Devices 12 nov 2012
User guide ARM CorePac User Guide for KeyStone II Devices 31 oct 2012
Application note Multicore Programming Guide (Rev. B) 29 ago 2012
User guide Semaphore2 Hardware Module for KeyStone Devices User's Guide (Rev. A) 24 abr 2012
User guide Serial Peripheral Interface (SPI) for KeyStone Devices User’s Guide (Rev. A) 30 mar 2012
User guide Chip Interrupt Controller (CIC) for KeyStone Devices User's Guide (Rev. A) 27 mar 2012
User guide 64-Bit Timer (Timer64) for KeyStone Devices User's Guide (Rev. A) 22 mar 2012
Application note PCIe Use Cases for KeyStone Devices 13 dic 2011
Application note Introduction to TMS320C6000 DSP Optimization 06 oct 2011
User guide Inter-Integrated Circuit (I2C) for KeyStone Devices User's Guide 02 sep 2011
User guide External Memory Interface (EMIF16) for KeyStone Devices User's Guide (Rev. A) 24 may 2011
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 19 may 2011
User guide C66x CPU and Instruction Set Reference Guide 09 nov 2010
User guide C66x DSP Cache User's Guide 09 nov 2010
Application note Clocking Design Guide for KeyStone Devices 09 nov 2010
User guide General-Purpose Input/Output (GPIO) forKeyStone Devices User's Guide 09 nov 2010
Application note Optimizing Loops on the C66x DSP 09 nov 2010

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

XEVMK2LX — Módulo de evaluación 66AK2L06

The XEVMK2LX is a full-featured evaluation and development tool for 66AK2Lx Keystone II based SoCs. Get started developing high speed data generation and acquisition systems for avionics and defense, test and measurement, medical, sonar and imaging applications today with this Wide PICMG ® AMC (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU200-U — Sonda de depuración XDS200 USB

El XDS200 es una sonda de depuración (emulador) que se utiliza para depurar dispositivos integrados de TI. El XDS200 presenta un equilibrio de bajo costo con buen rendimiento en comparación con el XDS110 de bajo costo y el XDS560v2 de alto rendimiento. Es compatible con una amplia (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-U — Sonda de depuración USB de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Kit de desarrollo de software (SDK)

BIOSLINUXMCSDK-K2 — MCSDK supporting SYS/BIOS RTOS and Linux OS for KeyStone II ARM A15 + DSP C66x

NOTE: K2x, C665x and C667x devices are now actively maintained on the Processor-SDK release stream. See links above.

Our Multicore Software Development Kits (MCSDK) provide highly-optimized bundles of foundational, platform-specific drivers to enable development on selected TI ARM and DSP devices. (...)

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-LINUX-K2L — Linux Processor SDK for K2L

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-LINUX-RT-K2L — Linux-RT Processor SDK for K2L

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RTOS-K2L — RTOS Processor SDK for K2L

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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Kit de desarrollo de software (SDK)

RFSDK — Kit de desarrollo de software de radiofrecuencia (RFSDK)

Texas Instruments Radio Frequency Software Development Kit (RFSDK) is a collection of highly optimized APIs and highly abstracted commands to control, configure and manage the JESD204B interface, digital front end (DFE), analog front end (AFE) and high speed data converters (ADC/DAC). The RFSDK (...)
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Controlador o biblioteca

MATHLIB — Biblioteca matemática DSP para dispositivos de punto flotante

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
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Controlador o biblioteca

SPRC264 — TMS320C5000/6000 Biblioteca de imágenes (IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
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Controlador o biblioteca

SPRC265 — TMS320C6000 Biblioteca DSP (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

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Este recurso de diseño es compatible con la mayoría de los productos de estas categorías.

Revise la página de detalles del producto para verificar la compatibilidad.
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C66XCODECS — CÓDECS (video, voz) para dispositivos basados en C66x

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66AK2L06 Power Consumption Model

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Herramienta de diseño

PROCESSORS-3P-SEARCH — MPU basada en Arm, MCU basada en Arm y herramienta de búsqueda de terceros DSP

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
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Diseños de referencia

TIDEP0081 — Diseño de referencia de diseño de receptor de banda ancha con conexión de 66AK2L06 JESD204B a ADC32R

For wideband receiver system developers currently using FPGA or ASIC to connect High Speed data converters to a baseband processor, who need faster time to market with increased performance and significant reduction in cost, power, and size. This reference design includes the first widely available (...)
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TIDEP0060 — Diseño de referencia de sistema de radar optimizado con un DSP+ARM SoC

For modern radar system developers currently using an FPGA or ASIC to connect to high speed data converters, who need faster time to market with increased performance and significant reduction in cost, power, and size, this reference design includes the first widely available processor integrating (...)
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Diseños de referencia

TIDEP0034 — Procesador 66AK2L06 DSP+ARM con conexión de JESD204B a ADC y DAC de banda ancha

For developers currently using an FPGA or ASIC to connect to high speed data converters who need faster time to market with increased performance and significant reduction in cost, power, and size this reference design includes the first widely available processor integrating a JESD204B interface (...)
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Esquema: PDF
Paquete Pasadores Descargar
FCBGA (CMS) 900 Ver opciones
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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