CD74FCT374

ACTIVO

Flip flops octales tipo D con Interfaz lógica BiCMOS FCT con salidas de 3 estados

Detalles del producto

Number of channels 8 Technology family FCT Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 48 IOH (max) (mA) -15 Supply current (max) (µA) 80 Features Very high speed (tpd 5-10ns) Operating temperature range (°C) 0 to 70 Rating Catalog
Number of channels 8 Technology family FCT Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 48 IOH (max) (mA) -15 Supply current (max) (µA) 80 Features Very high speed (tpd 5-10ns) Operating temperature range (°C) 0 to 70 Rating Catalog
SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • BiCMOS Technology With Low Quiescent Power
  • 3-State Outputs Drive Bus Lines Directly
  • Buffered Inputs
  • Noninverted Outputs
  • Input/Output Isolation From VCC
  • Controlled Output Edge Rates
  • 48-mA Output Sink Current
  • Output Voltage Swing Limited to 3.7 V
  • SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
  • Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP
  • BiCMOS Technology With Low Quiescent Power
  • 3-State Outputs Drive Bus Lines Directly
  • Buffered Inputs
  • Noninverted Outputs
  • Input/Output Isolation From VCC
  • Controlled Output Edge Rates
  • 48-mA Output Sink Current
  • Output Voltage Swing Limited to 3.7 V
  • SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
  • Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP

The CD74FCT374 is an octal, edge-triggered, D-type flip-flop that uses a small-geometry BiCMOS technology and features 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The output stage is a combination of bipolar and CMOS transistors that limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 48 mA.

The eight flip-flops enter data into their registers on the low-to-high transition of the clock (CLK). The output-enable (OE\) input controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.

A buffered OE\ input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD74FCT374 is characterized for operation from 0°C to 70°C.

The CD74FCT374 is an octal, edge-triggered, D-type flip-flop that uses a small-geometry BiCMOS technology and features 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The output stage is a combination of bipolar and CMOS transistors that limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 48 mA.

The eight flip-flops enter data into their registers on the low-to-high transition of the clock (CLK). The output-enable (OE\) input controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.

A buffered OE\ input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD74FCT374 is characterized for operation from 0°C to 70°C.

Descargar

Productos similares que pueden interesarle

open-in-new Comparar alternativas
Pin por pin con la misma funcionalidad que el dispositivo comparado
SN74AHCT374 ACTIVO Biestables de tipo D con activación de borde octal con salidas de 3 estados Larger voltage range (2V to 5.5V)

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 1
Tipo Título Fecha
* Data sheet BiCMOS Octal Edge-Triggered D-Type Flip-Flop With 3-State Outputs datasheet 03 jul 2000

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​