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CD74HC4017-EP

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CD74HC4017-EP

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Detalles del producto

Function Counter Bits (#) 10 Technology family HC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Input type Standard CMOS Output type Push-Pull Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -40 to 125 Rating HiRel Enhanced Product
Function Counter Bits (#) 10 Technology family HC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Input type Standard CMOS Output type Push-Pull Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -40 to 125 Rating HiRel Enhanced Product
SOIC (D) 16 59.4 mm² 9.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Fully Static Operation
  • Buffered Inputs
  • Common Reset
  • Positive Edge Clocking
  • Typical fmax = 60 MHz at VCC = 5 V, CL = 15 pF, TA = 25°C
  • Fanout (Over Temperature Range)
    • Standard Outputs . . . 10 LSTTL Loads
    • Bus Driver Outputs . . . 15 LSTTL Loads
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • VCC Voltage = 2 V to 6 V
  • High Noise Immunity NIL or NIH = 30% of VCC, VCC = 5 V

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Fully Static Operation
  • Buffered Inputs
  • Common Reset
  • Positive Edge Clocking
  • Typical fmax = 60 MHz at VCC = 5 V, CL = 15 pF, TA = 25°C
  • Fanout (Over Temperature Range)
    • Standard Outputs . . . 10 LSTTL Loads
    • Bus Driver Outputs . . . 15 LSTTL Loads
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • VCC Voltage = 2 V to 6 V
  • High Noise Immunity NIL or NIH = 30% of VCC, VCC = 5 V

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The CD74HC4017 is a high-speed silicon-gate CMOS 5-stage Johnson counter with ten decoded outputs. Each of the decoded outputs normally is low and sequentially goes high on the low-to-high transition clock period of the ten-clock-period cycle. The carry (TC) output transitions low to high after output 9 goes from high to low and can be used in conjunction with the clock enable (CE)\ input to cascade several stages. CE\ disables counting when in the high state. A master reset (MR) input also is provided that, when taken high, sets all the decoded outputs, except output 0, to low.

The device can drive up to ten low-power Schottky equivalent loads.

The CD74HC4017 is a high-speed silicon-gate CMOS 5-stage Johnson counter with ten decoded outputs. Each of the decoded outputs normally is low and sequentially goes high on the low-to-high transition clock period of the ten-clock-period cycle. The carry (TC) output transitions low to high after output 9 goes from high to low and can be used in conjunction with the clock enable (CE)\ input to cascade several stages. CE\ disables counting when in the high state. A master reset (MR) input also is provided that, when taken high, sets all the decoded outputs, except output 0, to low.

The device can drive up to ten low-power Schottky equivalent loads.
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Documentación técnica

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Tipo Título Fecha
* Data sheet CD74HC4017-EP datasheet 05 dic 2003
* VID CD74HC4017-EP VID V6204703 21 jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 may 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 abr 1996

Diseño y desarrollo

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Paquete Pasadores Descargar
SOIC (D) 16 Ver opciones
TSSOP (PW) 16 Ver opciones
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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