MSP430FR6922
MCU de 16 MHz con 64 KB FRAM, 2 KB SRAM, LCD, AES, 12 bit ADC, comparador, DMA, UART/SPI/I2C, tempor
MSP430FR6922
- Embedded Microcontroller
- 16-Bit RISC Architecture up to 16-MHz Clock
- Wide Supply Voltage Range From 3.6 V Down to 1.8 V (Minimum Supply Voltage is Restricted by SVS Levels, See the SVS Specifications)
- Optimized Ultra-Low-Power Modes
- Active Mode: Approximately 100 µA/MHz
- Standby (LPM3 With VLO): 0.4 µA (Typical)
- Real-Time Clock (RTC) (LPM3.5): 0.35 µA (Typical) (1)
- Shutdown (LPM4.5): 0.04 µA (Typical)
- Ultra-Low-Power Ferroelectric RAM (FRAM)
- Up to 64KB of Nonvolatile Memory
- Ultra-Low-Power Writes
- Fast Write at 125 ns per Word (64KB in 4 ms)
- Unified Memory = Program, Data, and Storage in One Single Space
- 1015 Write Cycle Endurance
- Radiation Resistant and Nonmagnetic
- Intelligent Digital Peripherals
- 32-Bit Hardware Multiplier (MPY)
- Three-Channel Internal Direct Memory Access (DMA)
- RTC With Calendar and Alarm Functions
- Five 16-Bit Timers With up to Seven Capture/Compare Registers
- 16-Bit and 32-Bit Cyclic Redundancy Checker (CRC16, CRC32)
- High-Performance Analog
- Up to 8-Channel Analog Comparator
- 12-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold and up to 8 External Input Channels
- Integrated 116-Segment LCD Driver With Contrast Control
- Code Security and Encryption
- 128-Bit or 256-Bit AES Security Encryption and Decryption Coprocessor (MSP430FR69xx(1) Only)
- True Random Number Seed for Random Number Generation Algorithm
- Lockable Memory Segments for IP Encapsulation and Secure Storage
- Multifunction Input/Output Ports
- All I/O Pins Support Capacitive Touch Capability Without Need for External Components
- Accessible Bit-, Byte- and Word-Wise (in Pairs)
- Edge-Selectable Wakeup From LPM on Ports P1 to P4
- Programmable Pullup and Pulldown on All Ports
- Enhanced Serial Communication
- eUSCI_A0 and eUSCI_A1 Support:
- UART With Automatic Baud-Rate Detection
- IrDA Encode and Decode
- SPI at Rates up to 10 Mbps
- eUSCI_B0 and eUSCI_B1 Support:
- I2C With Multiple-Slave Addressing
- SPI at Rates up to 10 Mbps
- eUSCI_A0 and eUSCI_A1 Support:
- Flexible Clock System
- Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
- Low-Power Low-Frequency Internal Clock Source (VLO)
- 32-kHz Crystals (LFXT)
- High-Frequency Crystals (HFXT)
- Development Tools and Software
- Free Professional Development Environments With EnergyTrace++™ Technology for Power Profiling and Debugging
- Microcontroller Development Boards Available
- Family Members
- Device Comparison Summarizes the Available Variants and Packages
- For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide
(1)The RTC is clocked by a 3.7-pF crystal.
This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.
Documentación técnica
Diseño y desarrollo
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
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parametric-filter Microcontrollers -
parametric-filter Productos Wi-Fi -
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| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| LQFP (PM) | 64 | Ultra Librarian |
| TSSOP (DGG) | 56 | Ultra Librarian |
| VQFN (RGC) | 64 | Ultra Librarian |
Pedidos y calidad
- RoHS
- REACH
- Marcado del dispositivo
- Acabado de plomo/material de la bola
- Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
- Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
- Contenido del material
- Resumen de calificaciones
- Monitoreo continuo de confiabilidad
- Lugar de fabricación
- Lugar de ensamblaje
Soporte y capacitación
Foros de TI E2E™ con asistencia técnica de los ingenieros de TI
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