Inicio Microcontroladores (MCU) y procesadores Microprocesadores y DSP SoC de redes industriales y multimedia
Inicio
Microcontroladores (MCU) y procesadores
Microprocesadores y DSP
SoC de redes industriales y multimedia

OMAP-L132

ACTIVO

DSP de punto flotante C674x de baja potencia + procesador Arm9 - 200 MHz

Haga su pedido ahora
Hoja de datos
Guías de usuario

OMAP-L132

ACTIVO
Hoja de datos Haga su pedido ahora

Detalles del producto

CPU 1 Arm9 Frequency (MHz) 200 Coprocessors C674x DSP Protocols Ethernet Hardware accelerators Programable real-time unit Operating system Linux, RTOS Security Device attestation & anti-counterfeit, Secure boot, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105
CPU 1 Arm9 Frequency (MHz) 200 Coprocessors C674x DSP Protocols Ethernet Hardware accelerators Programable real-time unit Operating system Linux, RTOS Security Device attestation & anti-counterfeit, Secure boot, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105
NFBGA (ZWT) 361 256 mm² (16 mm × 16 mm)
  • Dual-Core SoC
    • 200-MHz ARM926EJ-S RISC MPU
    • 200-MHz C674x Fixed- and Floating-Point VLIW DSP
  • ARM926EJ-S Core
    • 32- and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single-Cycle MAC
    • ARM Jazelle Technology
    • Embedded ICE-RT for Real-Time Debug
  • ARM9 Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 1600 MIPS and 1200 MFLOPS
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units:
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP × SP → SP Per Clock
        • 2 SP × SP → DP Every Two Clocks
        • 2 SP × DP → DP Every Three Clocks
        • 2 DP × DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 × 32-Bit Multiplies, Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSPBIOS
    • Chip Support Library and DSP Library
  • 128KB of RAM Shared Memory
  • 1.8-V or 3.3-V LVCMOS I/Os (Except for USB and DDR2 Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM With 128-MB Address Space
    • DDR2/Mobile DDR Memory Controller With one of the Following:
      • 16-Bit DDR2 SDRAM With 256-MB Address Space
      • 16-Bit mDDR SDRAM With 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • Two Serial Peripheral Interfaces (SPIs) Each With Multiple Chip Selects
  • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interfaces With Secure Data I/O (SDIO) Interfaces
  • Two Master and Slave Inter-Integrated Circuits
    (I2C Bus™)
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Real-Time Unit (PRU) Cores
      • 32-Bit Load-Store RISC Architecture
      • 4KB of Instruction RAM Per Core
      • 512 Bytes of Data RAM Per Core
      • PRUSS can be Disabled Through Software to Save Power
      • Register 30 of Each PRU is Exported From the Subsystem in Addition to the Normal R31 Output of the PRU Cores.
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1, 2, 3, and 4 (Control, Bulk, Interrupt, or ISOC) RX and TX
  • One Multichannel Audio Serial Port (McASP):
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO Buffers for Transmit and Receive
  • Two Multichannel Buffered Serial Ports (McBSPs):
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-Channel TDM
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant
    • MII Media-Independent Interface
    • RMII Reduced Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Real-Time Clock (RTC) With 32-kHz Oscillator and Separate Power Rail
  • Three 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose or Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Two Enhanced High-Resolution Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge Outputs, 6 Dual-Edge Symmetric Outputs, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Packages:
    • 361-Ball Pb-Free PBGA [ZWT Suffix],
      0.80-mm Ball Pitch
  • Commercial or Extended Temperature

All trademarks are the property of their respective owners.

  • Dual-Core SoC
    • 200-MHz ARM926EJ-S RISC MPU
    • 200-MHz C674x Fixed- and Floating-Point VLIW DSP
  • ARM926EJ-S Core
    • 32- and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single-Cycle MAC
    • ARM Jazelle Technology
    • Embedded ICE-RT for Real-Time Debug
  • ARM9 Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 1600 MIPS and 1200 MFLOPS
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units:
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP × SP → SP Per Clock
        • 2 SP × SP → DP Every Two Clocks
        • 2 SP × DP → DP Every Three Clocks
        • 2 DP × DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 × 32-Bit Multiplies, Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSPBIOS
    • Chip Support Library and DSP Library
  • 128KB of RAM Shared Memory
  • 1.8-V or 3.3-V LVCMOS I/Os (Except for USB and DDR2 Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM With 128-MB Address Space
    • DDR2/Mobile DDR Memory Controller With one of the Following:
      • 16-Bit DDR2 SDRAM With 256-MB Address Space
      • 16-Bit mDDR SDRAM With 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • Two Serial Peripheral Interfaces (SPIs) Each With Multiple Chip Selects
  • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interfaces With Secure Data I/O (SDIO) Interfaces
  • Two Master and Slave Inter-Integrated Circuits
    (I2C Bus™)
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Real-Time Unit (PRU) Cores
      • 32-Bit Load-Store RISC Architecture
      • 4KB of Instruction RAM Per Core
      • 512 Bytes of Data RAM Per Core
      • PRUSS can be Disabled Through Software to Save Power
      • Register 30 of Each PRU is Exported From the Subsystem in Addition to the Normal R31 Output of the PRU Cores.
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1, 2, 3, and 4 (Control, Bulk, Interrupt, or ISOC) RX and TX
  • One Multichannel Audio Serial Port (McASP):
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO Buffers for Transmit and Receive
  • Two Multichannel Buffered Serial Ports (McBSPs):
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-Channel TDM
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant
    • MII Media-Independent Interface
    • RMII Reduced Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Real-Time Clock (RTC) With 32-kHz Oscillator and Separate Power Rail
  • Three 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose or Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Two Enhanced High-Resolution Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge Outputs, 6 Dual-Edge Symmetric Outputs, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Packages:
    • 361-Ball Pb-Free PBGA [ZWT Suffix],
      0.80-mm Ball Pitch
  • Commercial or Extended Temperature

All trademarks are the property of their respective owners.

The OMAP-L132 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-, 16-, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM9 core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM9 core has separate 16-KB instruction and 16-KB data caches. Both caches are 4-way associative with virtual index virtual tag (VIVT). The ARM9 core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a
32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by the ARM9 and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

For security-enabled devices, TI’s Basic Secure Boot lets users protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust," the secure boot flow ensures a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port can be enabled during the secure boot process during application development. The boot modules are encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. Encryption and decryption protects customers’ IP and lets them securely set up the system and begin device operation with known, trusted code.

Basic Secure Boot uses either SHA-1 or SHA-256, and AES-128 for boot image validation. Basic Secure Boot also uses AES-128 for boot image encryption. The secure boot flow employs a multilayer encryption scheme which not only protects the boot process but also offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect customer encryption keys. When an update is needed, the customer creates a new encrypted image. Then the device can acquire the image through an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, see the .

The peripheral set includes: a 10/100 Mbps Ethernet media access controller (EMAC) with a management data input/output (MDIO) module; one USB2.0 OTG interface; two I2C Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSPs) with FIFO buffers; two serial peripheral interfaces (SPIs) with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as a watchdog); a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

The EMAC provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM9 and DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

The OMAP-L132 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-, 16-, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM9 core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM9 core has separate 16-KB instruction and 16-KB data caches. Both caches are 4-way associative with virtual index virtual tag (VIVT). The ARM9 core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a
32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by the ARM9 and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

For security-enabled devices, TI’s Basic Secure Boot lets users protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust," the secure boot flow ensures a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port can be enabled during the secure boot process during application development. The boot modules are encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. Encryption and decryption protects customers’ IP and lets them securely set up the system and begin device operation with known, trusted code.

Basic Secure Boot uses either SHA-1 or SHA-256, and AES-128 for boot image validation. Basic Secure Boot also uses AES-128 for boot image encryption. The secure boot flow employs a multilayer encryption scheme which not only protects the boot process but also offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect customer encryption keys. When an update is needed, the customer creates a new encrypted image. Then the device can acquire the image through an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, see the .

The peripheral set includes: a 10/100 Mbps Ethernet media access controller (EMAC) with a management data input/output (MDIO) module; one USB2.0 OTG interface; two I2C Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSPs) with FIFO buffers; two serial peripheral interfaces (SPIs) with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as a watchdog); a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

The EMAC provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM9 and DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.
filter Buscar otro/a SoC de redes industriales y multimedia
Descargar Ver vídeo con transcripción Video
Soporte de diseño limitado de TI disponible

Los proyectos existentes que utilizan este producto tienen un soporte de diseño limitado de TI. Si está disponible, encontrará material adicional, software y herramientas relevantes en la página del producto. Los diseños existentes que utilizan este producto tienen un soporte de diseño limitado de TI. Solicite asistencia limitada para diseño en los foros de asistencia TI E2E™.

Documentación técnica

No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 44
Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos OMAP-L132 C6000™ DSP+ARM Processor datasheet (Rev. E) PDF | HTML 31/01/2017
* Guía del usuario OMAP-L132 C6000 DSP+ARM Processor Technical Reference Manual (Rev. C) 12/09/2016
* Errata OMAP-L132 C6000 DSP+ARM Processor Errata (Silicon Revisions 2.3, 2.1) (Rev. G) 21/03/2014
Guía del usuario ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Z) PDF | HTML 30/03/2023
Guía del usuario ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. W) PDF | HTML 30/03/2023
Nota sobre la aplicación OMAPL138/C6748 ROM Bootloader Resources and FAQ (Rev. A) PDF | HTML 21/01/2021
Guía del usuario SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 1/06/2020
Nota sobre la aplicación Programming mDDR/DDR2 EMIF on OMAP-L1x/C674x 20/12/2019
Guía del usuario L138/C6748 development kit (LCDK) (Rev. A) PDF | HTML 18/09/2019
Nota sobre la aplicación Using DSPLIB FFT Implementation for Real Input and Without Data Scaling PDF | HTML 11/06/2019
Nota sobre la aplicación TDA2x/TDA2E Performance (Rev. A) PDF | HTML 10/06/2019
Nota sobre la aplicación OMAP-L132/L138 Power Consumption Summary 1/04/2019
Nota sobre la aplicación General Hardware Design/BGA PCB Design/BGA PDF | HTML 22/02/2019
Nota sobre la aplicación OMAP-L13x / C674x / AM1x schematic review guidelines PDF | HTML 14/02/2019
Nota sobre la aplicación Using the OMAP-L132/L138 Bootloader Application Report (Rev. F) PDF | HTML 22/01/2019
Nota sobre la aplicación McASP Design Guide - Tips, Tricks, and Practical Examples 10/01/2019
Guía del usuario PRU Assembly Instruction User Guide 16/02/2018
Nota sobre la aplicación Processor SDK RTOS Audio Benchmark Starter Kit 12/04/2017
Nota sobre la aplicación TI DSP Benchmarking PDF | HTML 13/01/2016
Nota sobre la aplicación OMAP-L132/L138, TMS320C6742/6/8 Pin Multiplexing Utility (Rev. B) 27/09/2013
Guía del usuario TMS320C6000 Optimizing Compiler v 7.4 User's Guide (Rev. U) 21/08/2012
Guía del usuario TMS320C6000 Assembly Language Tools v 7.4 User's Guide (Rev. W) 21/08/2012
Nota sobre la aplicación Powering the OMAP-L132/OMAP-L137/OMAP-L138 Processor with the TPS650061 13/04/2012
Informe MityDSP®-L138F Software Defined Radio Using uPP Data Transfer (Rev. A) 2/02/2012
Nota sobre la aplicación Powering the TMS320C6742, TMS320C6746, and TMS320C6748 With the TPS650061 19/12/2011
Nota sobre la aplicación Introduction to TMS320C6000 DSP Optimization 6/10/2011
Guía del usuario TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (Rev. F) 14/09/2011
Nota sobre la aplicación Simple Power Solution Using LDOs (Rev. B) 29/08/2011
Nota sobre la aplicación Powering OMAP-L132/L138, C6742/4/6, and AM18x with TPS65070 (Rev. B) 29/08/2011
Nota sobre la aplicación High-Vin, High-Efficiency Power Solution Using DC/DC Converter With DVFS (Rev. C) 29/08/2011
Informe OpenCV on TI’s DSP+ARM® 27/07/2011
Nota sobre la aplicación TMS320C674x/OMAP-L1x Processor Security 8/06/2011
Product overview OMAP-L1x C6000 DSP+ARM Processors Product Bulletin (Rev. A) 10/03/2011
Guía del usuario TMS320C674x DSP Megamodule Reference Guide (Rev. A) 3/08/2010
Guía del usuario TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B) 30/07/2010
Nota sobre la aplicación High-Efficiency Power Solution Using DC/DC Converters With DVFS (Rev. A) 5/05/2010
Nota sobre la aplicación High-Integration, High-Efficiency Power Solution Using DC/DC Converters w/DVFS (Rev. A) 5/05/2010
Nota sobre la aplicación Canny Edge Detection Implementation on TMS320C64x/64x+ Using VLIB 25/11/2009
Nota sobre la aplicación TMS320C6748/46/42 & OMAP-L1x8 USB Upstream Device Compliance Testing 17/08/2009
Nota sobre la aplicación TMS320C6748/46/42 & OMAP-L132/L138 USB Downstream Host Compliance Testing 17/08/2009
Informe Efficient Fixed- and Floating-Point Code Execution on the TMS320C674x Core 24/06/2009
Nota sobre la aplicación TMS320C674x/OMAP-L1x USB Compliance Checklist 12/03/2009
Guía del usuario TMS320C674x DSP Cache User's Guide (Rev. A) 11/02/2009
Nota sobre la aplicación Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A) 17/07/2008

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Kit de desarrollo

TMDSLCDK138 — Kit de desarrollo (LCDK) OMAP-L138

El kit de desarrollo OMAP-L138 DSP+Arm9™ permitirá un desarrollo rápido y sencillo de software y hardware de Linux. Esta plataforma escalable facilitará y acelerará el desarrollo de software y hardware de aplicaciones cotidianas que requieren un procesamiento de señales en tiempo real y un control (...)

Productos y hardware compatibles
En inventario
Límite:
??asset.out-of-stock-ti_es_MX??
No disponible
Kit de desarrollo

TMDSLCDK6748 — Kit de desarrollo (LCDK) TMS320C6748 DSP

The TMS320C6748 DSP development kit (LCDK) is a scalable platform that breaks down development barriers for applications that require embedded analytics and real-time signal processing, including biometric analytics, communications and audio. The low-cost LCDK will also speed and ease your hardware (...)

Productos y hardware compatibles
En inventario
Límite:
??asset.out-of-stock-ti_es_MX??
No disponible
Sonda de depuración

TMDSEMU200-U — Sonda de depuración XDS200 USB

El XDS200 es una sonda de depuración (emulador) que se utiliza para depurar dispositivos integrados de TI. Para la mayoría de los dispositivos, se recomienda utilizar el XDS110 (www.ti.com/tool/TMDSEMU110-U), que es más nuevo y de menor costo. El XDS200 es compatible con una amplia variedad de (...)

Productos y hardware compatibles
En inventario
Límite:
??asset.out-of-stock-ti_es_MX??
No disponible
Sonda de depuración

TMDSEMU560V2STM-U — Sonda de depuración USB para rastreo del sistema con el software XDS560™ v2

El XDS560v2 es el modelo de mayor rendimiento de la familia de sondas de depuración XDS560™ y es compatible tanto con el estándar JTAG tradicional (IEEE 1149.1) como con cJTAG (IEEE 1149.7).  Tenga en cuenta que no es compatible con la depuración por cable serie (SWD).

Todas las sondas de (...)

Productos y hardware compatibles
En inventario
Límite:
??asset.out-of-stock-ti_es_MX??
No disponible
Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

Productos y hardware compatibles
En inventario
Límite:
??asset.out-of-stock-ti_es_MX??
No disponible
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-OMAPL138 — SDK de procesador para procesadores OMAPL138: Compatibilidad con Linux y TI-RTOS

El procesador de kit de desarrollo de software (SDK) es una plataforma de software unificada para procesadores integrados de TI que ofrece una configuración sencilla y un rápido acceso inmediato a pruebas de rendimiento y demostraciones.  Todas las versiones del SDK del procesador son coherentes (...)

Productos y hardware compatibles
IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

Productos y hardware compatibles
Sistema operativo (SO)

MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify (...)
Desde: Mentor Graphics Corporation
Productos y hardware compatibles
Controlador o biblioteca

MATHLIB — Biblioteca matemática DSP para dispositivos de punto flotante

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
Productos y hardware compatibles
Controlador o biblioteca

SPRC265 — Biblioteca DSP TMS320C6000 (DSPLIB)

La biblioteca de procesadores de señales digitales (DSPLIB) TMS320C6000 es una biblioteca de funciones DSP optimizada para la plataforma para programadores C. Incluye rutinas de procesamiento de señales de uso general e invocables en C que se suelen utilizar en aplicaciones en tiempo real de gran (...)

Productos y hardware compatibles
Controlador o biblioteca

TELECOMLIB — Bibliotecas de telecomunicaciones y medios: FAXLIB, VoLIB y AEC/AER para procesadores TMS320C64x+ y

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

Productos y hardware compatibles
Códec de software

ADT-3P-DSPVOIPCODECS — Tecnologías digitales adaptables DSP VOIP, códecs de voz y audio

Adaptive Digital is a developer of voice quality enhancement algorithms, and best-in-class acoustic echo cancellation software that work with TI DSPs. Adaptive Digital has extensive experience in the algorithm development, implementation, optimization and configuration tuning. They provide (...)
Desde: Adaptive Digital Technologies, Inc.
Productos y hardware compatibles
Modelo de simulación

OMAP-L132 ZWT IBIS Model (Rev. A)

SPRM523A.ZIP (121 KB) - Modelo IBIS
Productos y hardware compatibles
Diseño de referencia

PR2084 — Alimentación de OMAP-L132/OMAP-L137/OMAP-L138 con TPS650061

This reference design presents a complete power solution and low-cost, discrete sequencing circuit for the OMAP-L132, OMAP-L137, and OMAP-L138 processors.
Productos y hardware compatibles
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
NFBGA (ZWT) 361 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

Ver todos los temas del foro en inglés

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

Videos