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SN65MLVD203

ACTIVO

Transceptor M-LVDS de dúplex completo

Detalles del producto

Function Transceiver Protocols M-LVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (MBits) 200 Input signal LVTTL, M-LVDS Output signal LVTTL, M-LVDS Rating Catalog Operating temperature range (°C) -40 to 85
Function Transceiver Protocols M-LVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (MBits) 200 Input signal LVTTL, M-LVDS Output signal LVTTL, M-LVDS Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 14 51.9 mm² 8.65 x 6
  • Low-Voltage Differential 30- Line Drivers and Receivers for Signaling Rates(1) Up to 200 Mbps
  • Type-1 Receivers Incorporate 25 mV of Hysteresis
  • Type-2 Receivers Provide an Offset (100 mV) Threshold to Detect Open-Circuit and Idle-Bus Conditions
  • Meets or Exceeds the M-LVDS Standard TIA/EIA-899 for Multipoint Data Interchange
  • Controlled Driver Output Voltage Transition Times for Improved Signal Quality
  • –1 V to 3.4 V Common-Mode Voltage Range Allows Data Transfer With 2 V of Ground Noise
  • Bus Pins High Impedance When Disabled or VCC ≤ 1.5 V
  • 100-Mbps Devices Available (SN65MLVD200A, 202A, 204A, 205A)
  • M-LVDS Bus Power Up/Down Glitch Free
  • APPLICATIONS
    • Low-Power High-Speed Short-Reach
      Alternative to TIA/EIA-485
    • Backplane or Cabled Multipoint Data and Clock Transmission
    • Cellular Base Stations
    • Central-Office Switches
    • Network Switches and Routers

(1) The signaling rate of a line, is the number of voltage transitions that are made per second expressed in the units bps (bits per second).

  • Low-Voltage Differential 30- Line Drivers and Receivers for Signaling Rates(1) Up to 200 Mbps
  • Type-1 Receivers Incorporate 25 mV of Hysteresis
  • Type-2 Receivers Provide an Offset (100 mV) Threshold to Detect Open-Circuit and Idle-Bus Conditions
  • Meets or Exceeds the M-LVDS Standard TIA/EIA-899 for Multipoint Data Interchange
  • Controlled Driver Output Voltage Transition Times for Improved Signal Quality
  • –1 V to 3.4 V Common-Mode Voltage Range Allows Data Transfer With 2 V of Ground Noise
  • Bus Pins High Impedance When Disabled or VCC ≤ 1.5 V
  • 100-Mbps Devices Available (SN65MLVD200A, 202A, 204A, 205A)
  • M-LVDS Bus Power Up/Down Glitch Free
  • APPLICATIONS
    • Low-Power High-Speed Short-Reach
      Alternative to TIA/EIA-485
    • Backplane or Cabled Multipoint Data and Clock Transmission
    • Cellular Base Stations
    • Central-Office Switches
    • Network Switches and Routers

(1) The signaling rate of a line, is the number of voltage transitions that are made per second expressed in the units bps (bits per second).

The SN65MLVD201, 203, 206, and 207 are multipoint-low-voltage differential (M-LVDS) line drivers and receivers, which are optimized to operate at signaling rates up to 200 Mbps. All parts comply with the multipoint low-voltage differential signaling (M-LVDS) standard TIA/EIA-899. These circuits are similar to their TIA/EIA-644 standard compliant LVDS counterparts, with added features to address multipoint applications. The driver output has been designed to support multipoint buses presenting loads as low as 30 , and incorporates controlled transition times to allow for stubs off of the backbone transmission line.

These devices have Type-1 and Type-2 receivers that detect the bus state with as little as 50 mV of differential input voltage over a common-mode voltage range of –1 V to 3.4 V. The Type-1 receivers exhibit 25 mV of differential input voltage hysteresis to prevent output oscillations with slowly changing signals or loss of input. Type-2 receivers include an offset threshold to provide a known output state under open-circuit, idle-bus, and other faults conditions. The devices are characterized for operation from –40°C to 85°C.

The SN65MLVD201, 203, 206, and 207 are multipoint-low-voltage differential (M-LVDS) line drivers and receivers, which are optimized to operate at signaling rates up to 200 Mbps. All parts comply with the multipoint low-voltage differential signaling (M-LVDS) standard TIA/EIA-899. These circuits are similar to their TIA/EIA-644 standard compliant LVDS counterparts, with added features to address multipoint applications. The driver output has been designed to support multipoint buses presenting loads as low as 30 , and incorporates controlled transition times to allow for stubs off of the backbone transmission line.

These devices have Type-1 and Type-2 receivers that detect the bus state with as little as 50 mV of differential input voltage over a common-mode voltage range of –1 V to 3.4 V. The Type-1 receivers exhibit 25 mV of differential input voltage hysteresis to prevent output oscillations with slowly changing signals or loss of input. Type-2 receivers include an offset threshold to provide a known output state under open-circuit, idle-bus, and other faults conditions. The devices are characterized for operation from –40°C to 85°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet Multipoint-LVDS Line Driver and Receiver datasheet (Rev. C) 07 ene 2008
Application note Introduction to M-LVDS (TIA/EIA-899) (Rev. A) 03 ene 2013
User guide Multipoint-Low Voltage Differential Signaling (M-LVDS) EVM (Rev. B) 05 abr 2004
Application note M-LVDS Signaling Rate Versus Distance 09 abr 2003
Application note Interoperability of M-LVDS and BusLVDS 06 feb 2003
User guide 200 Mbps Multipoint-Low Voltage Differential Signaling (M-LVDS) EVM (Rev. A) 20 dic 2002
Application note Wired-Logic Signaling with M-LVDS 31 oct 2002
User guide Multipoint-Low Voltage Differential Signaling (M-LVDS) Evaluation Module 04 mar 2002
Application note TIA/EIA-485 and M-LVDS, Power and Speed Comparison 20 feb 2002

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

MLVD20XBEVM — Módulo de evaluación LVDS multipunto (M-LVDS) dúplex completo y semidúplex SN65MLVD203B y SN65MLVD20

Guía del usuario: PDF
Placa de evaluación

MLVD20XEVM — Módulo de evaluación M-LVDS

This evaluation module is for the SN65MLVD203B and SN65MLVD204B, which are M-LVDS transceivers.
The SN65MLVD203B is a full-duplex transceiver, and the SN65MLVD204B is a half-duplex transceiver.
Guía del usuario: PDF
Modelo de simulación

SN65MLVD203 IBIS Model (Rev. A)

SLLC118A.ZIP (18 KB) - IBIS Model
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Diseños de referencia

TIDA-00330 — Diseño de referencia del transceptor M-LVDS aislado reforzado

This reference design demonstrates the performance of a reinforced, isolated, full-duplex M-LVDS transceiver node using the ISO7842 and SN65MLVD203. A single reinforced digital isolator replaces two basic digital isolators, reducing cost and PCB area.
Design guide: PDF
Esquema: PDF
Paquete Pasadores Descargar
SOIC (D) 14 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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