The TMUX7211, TMUX7212, and TMUX7213 are complementary metal-oxide semiconductor (CMOS) switches with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX721x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.
The switches of the TMUX721x are controlled with appropriate logic control inputs on the SELx pins. The TMUX721x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.
The TMUX721x family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX721x family of switches and multiplexers to be used in harsh environments.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX721x 44 V, Low-RON, 1:1 (SPST), 4-Channel Precision Switches with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. C) | PDF | HTML | 31 ago 2021 |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 may 2022 | |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 sep 2021 | ||
| Application brief | Precision Multiplexers Reducing Barriers in an Industrial Environment | PDF | HTML | 21 may 2021 | |
| Certificate | TMUX7212EVM EU RoHS Declaration of Conformity (DoC) | 08 ene 2021 | ||
| EVM User's guide | TMUX721xEVM Evaluation Module | 23 dic 2020 |
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El TMUX721xEVM admite la evaluación de los dispositivos TMUX721x en el encapsulado TSSOP (PW) de 16 pines, incluidos TMUX7211PWR, TMUX7212PWR y TMUX7213PWR. Este módulo de evaluación puede utilizarse para la creación rápida de prototipos y pruebas de dispositivos TMUX721x, específicamente para (...)
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Paquete | Pasadores | Descargar |
|---|---|---|
| TSSOP (PW) | 16 | Ver opciones |
| WQFN (RUM) | 16 | Ver opciones |
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